On the role of the powder stream on the heat and fluid flow conditions during Directed Energy Deposition of maraging steel-Fig3

On the role of the powder stream on the heat and fluid flow conditions during Directed Energy Deposition of maraging steel—Multiphysics modeling and experimental validation

MohamadBayataVenkata K.NadimpalliaFrancesco G.BiondaniaSinaJafarzadehbJesperThorborgaNiels S.TiedjeaGiulianoBissaccoaDavid B.PedersenaJesper H.Hattela
a Department of Mechanical Engineering, Technical University of Denmark, Building 425, Lyngby, Denmark
Department of Energy Conversion and Storage, Technical University of Denmark, Building 301, Lyngby, Denmark

Received 15 December 2020, Revised 12 April 2021, Accepted 19 April 2021, Available online 8 May 2021.

Abstract

The Directed Energy Deposition (DED) process of metals, has a broad range of applications in several industrial sectors. Surface modification, component repairing, production of functionally graded materials and more importantly, manufacturing of complex geometries are major DED’s applications. In this work, a multi-physics numerical model of the DED process of maraging steel is developed to study the influence of the powder stream specifications on the melt pool’s thermal and fluid dynamics conditions. The model is developed based on the Finite Volume Method (FVM) framework using the commercial software package Flow-3D. Different physical phenomena e.g. solidification, evaporation, the Marangoni effect and the recoil pressure are included in the model. As a new feature, the powder particles’ dynamics are modeled using a Lagrangian framework and their impact on the melt pool conditions is taken into account as well. In-situ and ex-situ experiments are carried out using a thermal camera and optical microscopy. The predicted track morphology is in good agreement with the experimental measurements. Besides, the predicted melt pool evolution follows the same trend as observed with the online thermal camera. Furthermore, a parametric study is carried out to investigate the effect of the powder particles incoming velocity on the track morphology. It is shown that the height-to-width ratio of tracks increases while using higher powder velocities. Moreover, it is shown that by tripling the powder particles velocity, the height-to-width ratio increases by 104% and the wettability of the track decreases by 24%.

Korea Abstract

금속의 DED (Directed Energy Deposition) 공정은 여러 산업 분야에서 광범위한 응용 분야를 가지고 있습니다. 표면 수정, 부품 수리, 기능 등급 재료의 생산 및 더 중요한 것은 복잡한 형상의 제조가 DED의 주요 응용 분야입니다.

이 작업에서는 용융 풀의 열 및 유체 역학 조건에 대한 분말 스트림 사양의 영향을 연구하기 위해 강철 마레이징 DED 공정의 다중 물리 수치 모델이 개발되었습니다. 이 모델은 상용 소프트웨어 패키지 FLOW-3D를 사용하여 FVM (Finite Volume Method) 프레임 워크를 기반으로 개발되었습니다.

다른 물리적 현상 예 : 응고, 증발, 마랑고니 효과 및 반동 압력이 모델에 포함됩니다. 새로운 기능으로 분말 입자의 역학은 Lagrangian 프레임 워크를 사용하여 모델링되며 용융 풀 조건에 미치는 영향도 고려됩니다.

현장 및 현장 실험은 열 화상 카메라와 광학 현미경을 사용하여 수행됩니다. 예측된 트랙 형태는 실험 측정과 잘 일치합니다. 게다가 예측된 용융 풀 진화는 온라인 열 화상 카메라에서 관찰된 것과 동일한 추세를 따릅니다. 또한, 분말 입자 유입 속도가 트랙 형태에 미치는 영향을 조사하기 위해 매개 변수 연구가 수행됩니다.

더 높은 분말 속도를 사용하는 동안 트랙의 높이 대 너비 비율이 증가하는 것으로 나타났습니다. 또한 분말 입자 속도를 3 배로 늘림으로써 높이 대 너비 비율이 104 % 증가하고 트랙의 젖음성은 24 % 감소하는 것으로 나타났습니다.

Keywords

Multi-physics modelDEDHeat and fluid flowFVMParticle motion

On the role of the powder stream on the heat and fluid flow conditions during Directed Energy Deposition of maraging steel-Fig
On the role of the powder stream on the heat and fluid flow conditions during Directed Energy Deposition of maraging steel-Fig
On the role of the powder stream on the heat and fluid flow conditions during Directed Energy Deposition of maraging steel-Fig2
On the role of the powder stream on the heat and fluid flow conditions during Directed Energy Deposition of maraging steel-Fig2
On the role of the powder stream on the heat and fluid flow conditions during Directed Energy Deposition of maraging steel-Fig3
On the role of the powder stream on the heat and fluid flow conditions during Directed Energy Deposition of maraging steel-Fig3
On the role of the powder stream on the heat and fluid flow conditions during Directed Energy Deposition of maraging steel-Fig4
On the role of the powder stream on the heat and fluid flow conditions during Directed Energy Deposition of maraging steel-Fig4
On the role of the powder stream on the heat and fluid flow conditions during Directed Energy Deposition of maraging steel-Fig5
On the role of the powder stream on the heat and fluid flow conditions during Directed Energy Deposition of maraging steel-Fig5
On the role of the powder stream on the heat and fluid flow conditions during Directed Energy Deposition of maraging steel-Fig6
On the role of the powder stream on the heat and fluid flow conditions during Directed Energy Deposition of maraging steel-Fig6
On the role of the powder stream on the heat and fluid flow conditions during Directed Energy Deposition of maraging steel-Fig7
On the role of the powder stream on the heat and fluid flow conditions during Directed Energy Deposition of maraging steel-Fig7
On the role of the powder stream on the heat and fluid flow conditions during Directed Energy Deposition of maraging steel-Fig8
On the role of the powder stream on the heat and fluid flow conditions during Directed Energy Deposition of maraging steel-Fig8
On the role of the powder stream on the heat and fluid flow conditions during Directed Energy Deposition of maraging steel-Fig9
On the role of the powder stream on the heat and fluid flow conditions during Directed Energy Deposition of maraging steel-Fig9
On the role of the powder stream on the heat and fluid flow conditions during Directed Energy Deposition of maraging steel-Fig10
On the role of the powder stream on the heat and fluid flow conditions during Directed Energy Deposition of maraging steel-Fig10
On the role of the powder stream on the heat and fluid flow conditions during Directed Energy Deposition of maraging steel-Fig11
On the role of the powder stream on the heat and fluid flow conditions during Directed Energy Deposition of maraging steel-Fig11
Fig. 9 (a) Velocity field, keyhole profile, and breakage of the keyhole to form bubble and (b) 2D temperature and velocity field along the longitudinal section

A Numerical Study on the Keyhole Formation During Laser Powder Bed Fusion Process

Keyhole에 대한 수치적 연구 : 레이저 분말 중 형성 베드 퓨전 공정

Subin Shrestha1
J.B. Speed School of Engineering,University of Louisville,Louisville, KY 40292
e-mail: subin.shrestha@louisville.edu

Y. Kevin Chou
J.B. Speed School of Engineering,University of Louisville,Louisville, KY 40292
e-mail: kevin.chou@louisville.edu

LPBF (Laser Powder Bed fusion) 공정 중 용융 풀의 동적 현상은 복잡하고 공정 매개 변수에 민감합니다. 에너지 밀도 입력이 특정 임계 값을 초과하면 키홀이라고 하는 거대한 증기 함몰이 형성 될 수 있습니다.

이 연구는 수치 분석을 통해 LPBF 과정에서 키홀 거동 및 관련 기공 형성을 이해하는 데 중점을 둡니다. 이를 위해 이산 분말 입자가 있는 열 유동 모델이 개발되었습니다.

이산 요소 방법 (DEM)에서 얻은 분말 분포는 계산 영역에 통합되어 FLOW-3D를 사용하는 3D 프로세스 물리학 모델을 개발합니다.

전도 모드 중 용융 풀 형성과 용융의 키홀 모드가 식별되고 설명되었습니다. 높은 에너지 밀도는 증기 기둥의 형성으로 이어지고 결과적으로 레이저 스캔 트랙 아래에 구멍이 생깁니다.

또한 다양한 레이저 출력과 스캔 속도로 인한 Keyhole 모양을 조사합니다. 수치 결과는 동일한 에너지 밀도에서도 레이저 출력이 증가함에 따라 Keyhole크기가 증가 함을 나타냅니다. Keyhole은 더 높은 출력에서 ​​안정되어 레이저 스캔 중 Keyhole 발생을 줄일 수 있습니다.

The dynamic phenomenon of a melt pool during the laser powder bed fusion (LPBF) process is complex and sensitive to process parameters. As the energy density input exceeds a certain threshold, a huge vapor depression may form, known as the keyhole. This study focuses on understanding the keyhole behavior and related pore formation during the LPBF process through numerical analysis. For this purpose, a thermo-fluid model with discrete powder particles is developed. The powder distribution, obtained from a discrete element method (DEM), is incorporated into the computational domain to develop a 3D process physics model using flow-3d. The melt pool formation during the conduction mode and the keyhole mode of melting has been discerned and explained. The high energy density leads to the formation of a vapor column and consequently pores under the laser scan track. Further, the keyhole shape resulted from different laser powers and scan speeds is investigated. The numerical results indicated that the keyhole size increases with the increase in the laser power even with the same energy density. The keyhole becomes stable at a higher power, which may reduce the occurrence of pores during laser scanning.

Keywords: additive manufacturing, keyhole, laser powder bed fusion, porosity

Fig. 1 (a) Powder added to the dispenser platform and (b) powder particles settled over build plate after the recoating process
Fig. 1 (a) Powder added to the dispenser platform and (b) powder particles settled over build plate after the recoating process
Fig. 2 3D computational domain used for single-track simulation
Fig. 2 3D computational domain used for single-track simulation
Fig. 3 Temperature-dependent material properties of Ti-6Al-4V
Fig. 3 Temperature-dependent material properties of Ti-6Al-4V
Fig. 4 Powder and substrate melting during laser application
Fig. 4 Powder and substrate melting during laser application
Fig. 5 Melt region formed after complete melting and solidification
Fig. 5 Melt region formed after complete melting and solidification
Fig. 6 Melt pool boundary comparison between the experiment [25] and the simulation
Fig. 6 Melt pool boundary comparison between the experiment [25] and the simulation
Fig. 7 Equilibrium points during the formation of vapor column [27]
Fig. 7 Equilibrium points during the formation of vapor column [27]
Fig. 8 Multiple reflection vectors from the keyhole wall
Fig. 8 Multiple reflection vectors from the keyhole wall
Fig. 9 (a) Velocity field, keyhole profile, and breakage of the keyhole to form bubble and (b) 2D temperature and velocity field along the longitudinal section
Fig. 9 (a) Velocity field, keyhole profile, and breakage of the keyhole to form bubble and (b) 2D temperature and velocity field along the longitudinal section
Fig. 10 Fluid flow in the transverse direction during keyhole melting
Fig. 10 Fluid flow in the transverse direction during keyhole melting
Fig. 11 Melt pool boundary compared with the experiment [21] for 195 W laser power and 400 mm/s scan speed
Fig. 11 Melt pool boundary compared with the experiment [21] for 195 W laser power and 400 mm/s scan speed
Fig. 12 Melt region formed after complete melting and solidification
Fig. 12 Melt region formed after complete melting and solidification
Fig. 13 2D images of the pores formed at the beginning of the single track and their 3D-rendered morphology
Fig. 13 2D images of the pores formed at the beginning of the single track and their 3D-rendered morphology
Fig. 14 Pore number and volume from a different level of power with LED = 0.4 J/mm [29]
Fig. 14 Pore number and volume from a different level of power with LED = 0.4 J/mm [29]
Fig. 15 Keyhole shape at different time steps from different parameters: (a) P = 100 W, v = 250 mm/s, (b) P = 200 W, v = 500 mm/s, (c) P = 300 W, v = 750 mm/s, and (d) P = 400 W, v = 1000 mm/s
Fig. 15 Keyhole shape at different time steps from different parameters: (a) P = 100 W, v = 250 mm/s, (b) P = 200 W, v = 500 mm/s, (c) P = 300 W, v = 750 mm/s, and (d) P = 400 W, v = 1000 mm/s
Fig. 16 Intensity dependence in the relationship between vapor column and evaporation pressure [27]
Fig. 16 Intensity dependence in the relationship between vapor column and evaporation pressure [27]
Fig. 17 Temperature distribution when laser has moved 0.8 mm with P = 300 W, v = 750 mm/s and P = 400 W, v = 1000 mm/s
Fig. 17 Temperature distribution when laser has moved 0.8 mm with P = 300 W, v = 750 mm/s and P = 400 W, v = 1000 mm/s
Fig. 18 Melt region with different level of power with LED of 0.4 J/mm
Fig. 18 Melt region with different level of power with LED of 0.4 J/mm

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Figure 2.6 ESI apparatus for offline analysis with microscope imaging.

MODELING AND CHARACTERIZATION OF MICROFABRICATED EMITTERS: IN PURSUIT OF IMPROVED ESI-MS PERFORMANCE

미세 가공 방사체의 모델링 및 특성화 : 개선된 ESI-MS 성능 추구

by XINYUN WU

A thesis submitted to the Department of Chemistry in conformity with the requirements for the degree of Master of Science Queen’s University Kingston, Ontario, Canada December, 2011 Copyright © Xinyun Wu, 2011

Abstract

ESI (Electrospray ionization)는 특히 탁월한 감도, 견고성 및 단순성으로 대형 생체 분자를 분석하는 데있어 질량 분석 (MS)에 매우 귀중한 기술이었습니다. ESI 기술 개발에 많은 노력을 기울였습니다. 그 형태와 기하학적 구조가 전기 분무 성능과 추가 MS 감지에 중추적 인 것으로 입증 되었기 때문입니다.

막힘 및 낮은 처리량을 포함하여 전통적인 단일 홀 이미터의 본질적인 문제는 기술의 적용 가능성을 제한합니다. 이 문제를 해결하기 위해 현재 프로젝트는 향상된 ESI-MS 분석을위한 다중 전자 분무(MES) 방출기를 개발하는데 초점을 맞추고 있습니다.

이 논문에서는 스프레이 전류 측정을 위한 전기 분무와 오프라인 전기 분무 실험을 위한 전산 유체 역학 (CFD) 시뮬레이션의 공동 작업이 수행되었습니다. 전기 분무 성능에 대한 다양한 이미터 설계의 영향을 테스트하기 위해 수치 시뮬레이션이 사용되었으며 실험실 결과는 가이드 및 검증으로 사용되었습니다.

CFD 코드는 Taylor-Melcher 누설 유전체 모델(LDM)을 기반으로 하며 과도 전기 분무 공정이 성공적으로 시뮬레이션되었습니다.

이 방법은 750 μm 내경 (i.d.) 이미 터를 통해 먼저 검증되었으며 20 μm i.d.에 추가로 적용되었습니다. 모델. 전기 분무 공정의 여러 단계가 시각적으로 시연되었으며 다양한 적용 전기장 및 유속에서 분무 전류의 변화에 ​​대한 정량적 조사는 이전 시뮬레이션 및 측정과 잘 일치합니다.

단일 조리개 프로토 타입을 기반으로 2 홀 및 3 홀 이미터로 MES 시뮬레이션을 수행했습니다. 시뮬레이션 예측은 실험 결과와 유사하게 비교되었습니다. 이 작업의 증거는 CFD 시뮬레이션이 MES의 이미 터 설계를 테스트하는 효과적인 수치 도구로 사용될 수 있음을 입증했습니다.

이 작업에서 달성 된 마이크로 스케일 에미 터 전기 분무의 성공적인 시뮬레이션에 대한 벤치마킹 결과는 현재까지 발표 된 전기 분무에 대한 동적 시뮬레이션의 가장 작은 규모로 여겨집니다.

Co-Authorship

공동 저자: 이 논문에 대한 모든 연구는 Natalie M. Cann 박사와 Richard D. Oleschuk 박사의 지도하에 완료되었습니다. 다중 전자 분무에 관한 4 장에서 제시된 연구 작업의 일부는 Ramin Wright가 공동 저술했으며, 이 작업은 press에서 다음 논문에서 인용되었습니다.

ibson,G.T.T.; Wright, R.D.; Oleschuk, R.D. Multiple electrosprays generated from a single poly carbonate microstructured fibre. Journal of Mass Spectrometry, 2011, in press.

Chapter 1 Introduction

소프트 이온화 방법으로 ESI (electrospray ionization)의 도입은 질량 분석법 (MS)의 적용 가능성에 혁명을 일으켰습니다. 이 기술의 부드러운 특징은 상대적으로 높은 전하를 가진 이온을 생성하는 고유한 이점으로 인해 액상에서 직접 펩티드 및 단백질과 같은 큰 생체 분자를 분석 할 수 있게했습니다 [1].

지난 10 년 동안 ESI-MS는 놀라운 성장을 보였으며 현재는 단백질 체학, 대사 체학, 글리코 믹스, 합성 화학자를 위한 식별 도구 등 다양한 생화학 분야에서 광범위하게 채택되고 있습니다 [2-3].

ESI-MS는 겔 전기 영동과 같은 생물학적 분자에 대한 기존의 질량 측정 기술보다 훨씬 빠르고 민감하며 정확합니다. 또한, 액체상에서 직접 분석 할 수 있는 큰 비 휘발성 분자의 능력은 고성능 액체 크로마토 그래피 (HPLC) 및 모세관 전기 영동 (CE)과 같은 업스트림 분리 기술과의 결합을 가능하게합니다 [4].

일반적인 ESI 공정은 일반적으로 액적 형성, 액적 수축 및 기상 이온의 최종 형성을 포함합니다. 일렉트로 스프레이의 성능에 영향을 미치는 많은 요소 중에서 스프레이를 위한 이미터의 구조 (즉, 기하학, 모양 등)가 중요한 요소입니다.

전통적인 전기 분무 이미터는 일반적으로 풀링 또는 에칭 기술로 제작 된 단일 채널 테이퍼 형 또는 비 테이퍼 형입니다. 그러나 이러한 이미터는 종종 막힘, 부적절한 처리량 등과 같은 문제로 어려움을 겪습니다. [5]

향상된 감도 및 샘플 활용을 위해 다중 스프레이를 생성하는 새로운 이미터 설계 개발로 분명한 발전이 있었습니다. 새로운 ESI 이미터 설계에 대한 연구는 실험적으로나 이론적으로 큰 관심을 불러 일으켰습니다 [3]. 그러나 ESI의 복잡한 물리적 과정은 팁 형상 외에도 많은 다른 변수에 의존하기 때문에 연구간 직접 비교의 어려움은 장애물이 됩니다.

또한 새로운 나노 이미터 제조 및 테스트 비용이 상당히 높을 수 있습니다. 이 논문은 CFD 시뮬레이션 도구를 활용하여 가상 랩을 설정함으로써 이러한 문제를 해결합니다. 다른 매개 변수로 인해 상호 연결된 변경 없이 다양한 이미터 설계를 비교할 수 있도록 이상적으로 균일한 물리적 조건을 제공합니다.

맞춤 제작된 프로토 타입의 실험 측정 값도 수집되어 더 나은 계산 체계를 형성하는 데 도움이 되는 지침과 검증을 모두 제공합니다. 특히 이 분야의 주요 미래 플랫폼으로 여겨지는 다중 노즐 이미 터 설계에 중점을 둘 것입니다.

전기 분무 거동에 영향을 미치는 요인에 대한 추가 기본 연구는 다양한 기하학적 및 작동 매개 변수와 관련하여 수행됩니다. 이는 보다 효율적이고 견고한 이미터의 개발을 가능하게 할 뿐만 아니라 더 넓은 영역에서 ESI의 적용을 향상시킬 수 있습니다.

Figure 1.1Schematic setup for ESI-MS technique
Figure 1.1Schematic setup for ESI-MS technique
Figure 1.2 Schematic of major processes occurring in electrospray [5].
Figure 1.2 Schematic of major processes occurring in electrospray [5].
Figure 1.3 Illustration of detailed geometric parameters of a spraying Taylor cone wherera is the radius of curvature of the best fitting circle at the tip of the cone; re is the radius of the emission region for droplets at the tip of a Taylor cone;is the liquid cone angle.
Figure 1.3 Illustration of detailed geometric parameters of a spraying Taylor cone wherera is the radius of curvature of the best fitting circle at the tip of the cone; re is the radius of the emission region for droplets at the tip of a Taylor cone;is the liquid cone angle.
Figure 1.4 (A)Externally tapered emitter  (B) Optical image of a clogged tapered emitter with normal use [46].
Figure 1.4 (A)Externally tapered emitter (B) Optical image of a clogged tapered emitter with normal use [46].
Figure 1.5 (A)Three by three configuration of an emitter array made with polycarbonate using laser ablation; (B) Photomicrograph of nine stable electrosprays generated from the nine-emitter array [52]
Figure 1.5 (A)Three by three configuration of an emitter array made with polycarbonate using laser ablation; (B) Photomicrograph of nine stable electrosprays generated from the nine-emitter array [52]
Figure 1.6 SEM images of the distal ends of four multichannel nanoelectrospray emitters and a tapered emitter: (A) 30 orifice emitter; (B) 54 orifice emitter; (C) 84 orifice emitter; (D) 168 orifice emitter; Scale bars in A, B, and C represent 50 μm, and 100 μm in D[54]
Figure 1.6 SEM images of the distal ends of four multichannel nanoelectrospray emitters and a tapered emitter: (A) 30 orifice emitter; (B) 54 orifice emitter; (C) 84 orifice emitter; (D) 168 orifice emitter; Scale bars in A, B, and C represent 50 μm, and 100 μm in D[54]
Figure 1.7 Photomicrographs of electrospray from of a 168-hole MCN emitter at different flow rates. (A) A traditional integrated Taylor cone observed from offline electrospray of water with 0.1% formic acid at 300 nL/min; (B) A mist of coalesced Taylor cones observed from offline electrospray at 25 nL/min[54]
Figure 1.7 Photomicrographs of electrospray from of a 168-hole MCN emitter at different flow rates. (A) A traditional integrated Taylor cone observed from offline electrospray of water with 0.1% formic acid at 300 nL/min; (B) A mist of coalesced Taylor cones observed from offline electrospray at 25 nL/min[54]
Figure 1.8 Circular arrays of etched emitters for better electric field homogeneity [53].
Figure 1.8 Circular arrays of etched emitters for better electric field homogeneity [53].
Figure 2.6 ESI apparatus for offline analysis with microscope imaging.
Figure 2.6 ESI apparatus for offline analysis with microscope imaging.
Figure 3.9 Typical panel for displaying instant simulation result during simulation process.
Figure 3.9 Typical panel for displaying instant simulation result during simulation process.
Figure 5.3 Generation of a Taylor cone-jet mode (simulation) plotted with iso-potential lines at times    (Top to bottom panels correspond to 0.002 s, 0.012 s, 0.018 s, 0.08 s respectively).
Figure 5.3 Generation of a Taylor cone-jet mode (simulation) plotted with iso-potential lines at times (Top to bottom panels correspond to 0.002 s, 0.012 s, 0.018 s, 0.08 s respectively).
Figure 5.8 (A) Taylor cone-jet profiles with different contact angle of 30 degrees and 20 degrees (B) under the same physical conditions of 6 kV and 0.04 m/s. (C) Cone-jet profile generated from a tapered tip with a 20 degree contact angle at 6 kV and 0.04 m/s (as a comparison with (B)).
Figure 5.8 (A) Taylor cone-jet profiles with different contact angle of 30 degrees and 20 degrees (B) under the same physical conditions of 6 kV and 0.04 m/s. (C) Cone-jet profile generated from a tapered tip with a 20 degree contact angle at 6 kV and 0.04 m/s (as a comparison with (B)).

Omit below: Please refer to the original text for the full content.

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Figure 1.1: A water droplet with a radius of 1 mm resting on a glass substrate. The surface of the droplet takes on a spherical cap shape. The contact angle θ is defined by the balance of the interfacial forces.

Effect of substrate cooling and droplet shape and composition on the droplet evaporation and the deposition of particles

기판 냉각 및 액적 모양 및 조성이 액적 증발 및 입자 증착에 미치는 영향

by Vahid Bazargan
M.A.Sc., Mechanical Engineering, The University of British Columbia, 2008
B.Sc., Mechanical Engineering, Sharif University of Technology, 2006
B.Sc., Chemical & Petroleum Engineering, Sharif University of Technology, 2006

고착 방울은 평평한 기판에 놓인 액체 방울입니다. 작은 고정 액적이 증발하는 동안 액적의 접촉선은 고정된 접촉 영역이 있는 고정된 단계와 고정된 접촉각이 있는 고정 해제된 단계의 두 가지 단계를 거칩니다. 고정된 접촉 라인이 있는 증발은 액적 내부에서 접촉 라인을 향한 흐름을 생성합니다.

이 흐름은 입자를 운반하고 접촉 선 근처에 침전시킵니다. 이로 인해 일반적으로 관찰되는 “커피 링”현상이 발생합니다. 이 논문은 증발 과정과 고착성 액적의 증발 유도 흐름에 대한 연구를 제공하고 콜로이드 현탁액에서 입자의 침착에 대한 통찰력을 제공합니다. 여기서 우리는 먼저 작은 고착 방울의 증발을 연구하고 증발 과정에서 기판의 열전도도의 중요성에 대해 논의합니다.

현재 증발 모델이 500µm 미만의 액적 크기에 대해 심각한 오류를 생성하는 방법을 보여줍니다. 우리의 모델에는 열 효과가 포함되어 있으며, 특히 증발 잠열의 균형을 맞추기 위해 액적에 열을 제공하는 기판의 열전도도를 포함합니다. 실험 결과를 바탕으로 접촉각의 진화와 관련된 접촉 선의 가상 움직임을 정의하여 고정 및 고정 해제 단계의 전체 증발 시간을 고려합니다.

우리의 모델은 2 % 미만의 오차로 500 µm보다 작은 물방울에 대한 실험 결과와 일치합니다. 또한 유한한 크기의 라인 액적의 증발을 연구하고 증발 중 접촉 라인의 복잡한 동작에 대해 논의합니다. 에너지 공식을 적용하고 접촉 선이 구형 방울의 후퇴 접촉각보다 높은 접촉각을 가진 선 방울의 두 끝에서 후퇴하기 시작 함을 보여줍니다. 그리고 라인 방울 내부의 증발 유도 흐름을 보여줍니다.

마지막으로, 계면 활성제 존재 하에서 접촉 라인의 거동을 논의하고 입자 증착에 대한 Marangoni 흐름 효과에 대해 논의합니다. 열 Marangoni 효과는 접촉 선 근처에 증착 된 입자의 양에 영향을 미치며, 기판 온도가 낮을수록 접촉 선 근처에 증착되는 입자의 양이 많다는 것을 알 수 있습니다.

Figure 1.1: A water droplet with a radius of 1 mm resting on a glass substrate. The surface of the droplet takes on a spherical cap shape. The contact angle θ is defined by the balance of the interfacial forces.
Figure 1.1: A water droplet with a radius of 1 mm resting on a glass substrate. The surface of the droplet takes on a spherical cap shape. The contact angle θ is defined by the balance of the interfacial forces.
Figure 2.1: Evaporation modes of sessile droplets on a substrate: (a) evaporation at constant contact angle (de-pinned stage) and (b) evaporation at constant contact area (pinned stage)
Figure 2.1: Evaporation modes of sessile droplets on a substrate: (a) evaporation at constant contact angle (de-pinned stage) and (b) evaporation at constant contact area (pinned stage)
Figure 2.2: A sessil droplet with its image can be profiled as the equiconvex lens formed by two intersecting spheres with radius of a.
Figure 2.2: A sessil droplet with its image can be profiled as the equiconvex lens formed by two intersecting spheres with radius of a.
Figure 2.3: The droplet life time for both evaporation modes derived from Equation 2.2.
Figure 2.3: The droplet life time for both evaporation modes derived from Equation 2.2.
Figure 2.4: A probability of escape for vapor molecules at two different sites of the surface of the droplet for diffusion controlled evaporation. The random walk path initiated from a vapor molecule is more likely to result in a return to the surface if the starting point is further away from the edge of the droplet.
Figure 2.4: A probability of escape for vapor molecules at two different sites of the surface of the droplet for diffusion controlled evaporation. The random walk path initiated from a vapor molecule is more likely to result in a return to the surface if the starting point is further away from the edge of the droplet.
Figure 2.5: Schematic of the sessile droplet on a substrate
Figure 2.5: Schematic of the sessile droplet on a substrate. The evaporation rate at the surface of the droplet is enhanced toward the edge of the droplet.
Figure 2.6: The domain mesh (a) and the solution of the Laplace equation for diffusion of the water vapor molecule with the concentration of Cv = 1.9×10−8 g/mm3 at the surface of the droplet into the ambient air with the relative humidity of 55%, i.e. φ = 0.55 (b).
Figure 2.6: The domain mesh (a) and the solution of the Laplace equation for diffusion of the water vapor molecule with the concentration of Cv = 1.9×10−8 g/mm3 at the surface of the droplet into the ambient air with the relative humidity of 55%, i.e. φ = 0.55 (b).
Figure 3.1: The portable micro printing setup. A motorized linear stage from Zaber Technologies Inc. was used to control the place and speed of the micro nozzle.
Figure 3.1: The portable micro printing setup. A motorized linear stage from Zaber Technologies Inc. was used to control the place and speed of the micro nozzle.
Figure 4.6: Temperature contours inside the substrate adjacent to the droplet
Figure 4.6: Temperature contours inside the substrate adjacent to the droplet
Figure 4.7: The effect of substrate cooling on the evaporation rate, the basic model shows the same value for all substrates.
Figure 4.7: The effect of substrate cooling on the evaporation rate, the basic model shows the same value for all substrates.

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레이저 용접 수치해석 (FLOW-3D WELD)

FLOW-3D WELD Products

레이저 용접 수치해석 (FLOW-3D WELD)

FLOW-3D@ WELD는 레이저 용접 공정에 대한 정확한 시뮬레이션 기능을 제공하여 최적화된 공정을 개발하게 합니다. 더 나은 공정 제어를 통해 기공, 열 영향 영역을 최소화하고 미세 구조 변화를 제어할 수 있습니다.

레이저 용접 프로세스를 정확하게 시뮬레이션하기 위해 FLOW-3D@ WELD는 레이저 열원, 레이저-재료 상호 작용, 유체 흐름, 열 전달, 표면 장력, 응고, 다중 레이저 반사 및 위상 변화와 같은 모든 관련 물리 모델을 제공합니다.

Laser Welding

최근에는 뛰어난 생산성과 속도, 낮은 열 입력이 결합되어 기존의 용접 프로세스를 대체하는 레이저 용접 프로세스가 주목 받고 있습니다. 레이저 용접이 제공하는 장점은 용접강도가 좋고, 열 영향 부위가 작으며, 정밀도가 낮고 변형이 적으며, 강철, 알루미늄, 티타늄 및 이종 금속을 포함한 광범위한 금속 및 합금을 용접 할 수 있는 기능이 있습니다.

FLOW-3D@는 레이저 용접 공정에 대한 강력한 통찰력을 제공하고 궁극적으로 프로세스 최적화를 달성하는 데 도움이 됩니다.

보다 나은 프로세스 제어를 통해 기공을 최소화할 수 있습니다. 열 영향부위 및 미세조직을 제어가 가능합니다. FLOW-3D는 자유표면 추적 알고리즘을 통해 매우 복잡한 용접 POOL 시뮬레이션을 해석하는데 매우 적합합니다.

용접 모듈은 레이저 소스에 의해 생성된 Heat flux, 용융 금속에 대한 증발압력, shield gas 효과, 용융 풀의 반동압력 및 다중 레이저 반사와 같은 물리적 모델을 FLOW-3D에 적용하기 위해 개발되었습니다. 키홀 용접과 같은 현실적인 프로세스 시뮬레이션을 위해서는 모든 관련 물리적 현상을 적용하는 것이 중요합니다.

FLOW-3D는 레이저 용접의 conduction and keyhole 방식을 시뮬레이션 할 수 있습니다. 전 세계의 연구원들은 FLOW-3D를 사용하여 용접역학을 분석하고, 공정 매개 변수를 최적화하여 기공을 최소화하며, 레이저 용접공정에서의 dendrite 결정 성장 양상을 예측합니다.

Shallow penetration weld (top left); deep penetration weld with shield gas effects (top right); deep penetration weld with shield gas and evaporation pressure (bottom left); and deep penetration weld with shield gas, evaporation pressure and multiple laser reflections effects (bottom right).

Full Penetration Laser Welding Experiments

한국 카이스트와 독일 BAM은 16K kW레이저를 사용하여 10mm강판에 완전 침투 레이저 용접 실험을 수행하였습니다. CCD카메라의 도움을 받아 완전 용입 레이저 용접으로 형성된 상단 및 하단 용융풀 거동을 확인할 수 있었습니다. 그들은 또한 FLOW-3D 로 용접 공정 해석으로 해석과 실험결과의 경향이 일치하는 것을 알 수 있었습니다.

Experimental setup with CCD cameras observing the top and bottom molten pools
Schematic of computation domain in FLOW-3D

 

Simulation results at the top show melt pool lengths of 8mm and 15mm, whereas experiments indicated melt pool lengths of 7mm and 13mm

Laser Welding Porosity Case Study

General Motors, Michigan, 중국의 상하이 대학교는 용접 공정 변수, 즉 keyhole 용접에서 기공의 발생에 대해 용접 속도 및 용접 각도와 같은 공정 매개 변수가 미치는 영향을 알아보기 위해 협력하여 연구를 진행하였습니다.

레이저 용접된 Al 접합부 단면의 기공을 분석합니다. Keyhole이 유도 된 기공들은 유동 역학으로 인해 발생되고 균열을 일으킬 수 있습니다. 최적화 공정의 매개변수는 이러한 종류의 기공을 완화할 수 있습니다. FLOW-3D를 사용하여 연구원들은 증발 및 반동 압력, 용융풀, 온도에 따른 표면장력 및 Keyhole내의 다중 레이저 반사, 프레넬 흡수를 포함한 모든 중요한 물리적 현상을 설명했습니다.

연구진은 시뮬레이션 모델을 기반으로 Keyhole 용접에서 생성된 기공들의 주요 원인으로 불안정한 Keyhole을 규정하였습니다. 아래 이미지에서 볼 수 있듯이 뒤쪽 용융 풀의 과도한 재순환은 뒤쪽 용융 풀이 앞쪽 용융 풀 경계를 무너뜨리며 기공들을 생성시킵니다. 갇힌 공간이 증가하는 응고 전면에 의해 갇혔을때 기공들이 발생되었습니다.

Distribution of porosity in longitudinal welding sections as seen in simulations (top) and experiments (bottom)

용접 속도가 빠를수록 더 큰 keyhole이 생성되며 이로 인해, 보다 안정적인 keyhole이 생성됩니다. 연구진은 FLOW-3D를 사용하여 용접 속도와 용접 경사각으로 기공들의 생성을 완화시킬 수 있었습니다.


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The realm of operations of FLOW-3D

ADDITIVE MANUFACTURING SIMULATIONS

Capabilities of FLOW-3D

FLOW-3D는 자유 표면 유체 흐름 시뮬레이션을 전문으로하는 다중 물리 CFD 소프트웨어입니다. 자유 표면의 동적 진화를 추적하는 소프트웨어의 알고리즘인 VOF (Volume of Fluid) 방법은 Flow Science의 설립자인 Tony Hirt 박사가 개척했습니다.

또한 FLOW-3D에는 금속 주조, 잉크젯 인쇄, 레이저 용접 및 적층 제조 (AM)와 같은 광범위한 응용 분야를 시뮬레이션하기위한 물리 모델이 내장되어 있습니다.
적층 제조 시뮬레이션 소프트웨어, 특히 L-PBF (레이저 파우더 베드 융합 공정)의 현상 유지는 열 왜곡, 잔류 응력 및지지 구조 생성과 같은 부분 규모 모델링에 도움이되는 열 기계 시뮬레이션에 초점을 맞추고 있습니다.

유용하지만 용융 풀 역학 및 볼링 및 다공성과 같은 관련 결함에 대한 정보는 일반적으로 이러한 접근 방식의 영역 밖에 있습니다. 용융 풀 내의 유체 흐름, 열 전달 및 표면 장력이 열 구배 및 냉각 속도에 영향을 미치며 이는 다시 미세 구조 진화에 영향을 미친다는 점을 명심하는 것도 중요합니다.

FLOW-3D와 이산 요소법 (DEM) 및 WELD 모듈을 사용하여 분말 및 용융 풀 규모에서 시뮬레이션 할 수 있습니다.
구현되는 관련 물리학에는 점성 흐름, 열 전달, 응고, 상 변화, 반동 압력, 차폐 가스 압력, 표면 장력, 움직이는 물체 및 분말 / 입자 역학이 포함됩니다. 이러한 접근 방식은 합금에 대한 공정을 성공적으로 개발할 수 있게 하고, AM 기계 제조업체와 AM 기술의 최종 사용자 모두에게 관심있는 미세 구조 진화에 대한 통찰력을 제공하는데 도움이 됩니다.

The realm of operations of FLOW-3D
The realm of operations of FLOW-3D

FLOW-3D는 레이저 분말 베드 융합 (L-PBF), 직접 에너지 증착 (DED) 및 바인더 제트 공정으로 확장되는 기능을 가지고 있습니다.
FLOW-3D를 사용하면 분말 확산 및 패킹, 레이저 / 입자 상호 작용, 용융 풀 역학, 표면 형태 및 후속 미세 구조 진화를 정확하게 시뮬레이션 할 수 있습니다. 이러한 기능은 FLOW-3D에 고유하며 계산 효율성이 높은 방식으로 달성됩니다.

예를 들어 1.0mm x 0.4mm x 0.3mm 크기의 계산 영역에서 레이저 빔의 단일 트랙을 시뮬레이션하기 위해 레이저 용융 모델은 단 8 개의 물리적 코어에서 약 2 시간이 걸립니다.
FLOW-3D는 모든 관련 물리 구현 간의 격차를 해소하는 동시에 업계 및 연구 표준에서 허용하는 시간 프레임으로 결과를 생성합니다. 분말 패킹, 롤러를 통한 파워 확산, 분말의 레이저 용융, 용융 풀 형성 및 응고를 고려하고 다층 분말 베드 융합 공정을 위해 이러한 단계를 순차적으로 반복하여 FLOW-3D에서 전체 AM 공정을 시뮬레이션 할 수 있습니다.

FLOW-3D의 다층 시뮬레이션은 이전에 응고된 층의 열 이력을 저장한다는 점에서 독특하며, 열 전달을 고려하여 이전에 응고된 층에 확산된 새로운 분말 입자 세트에 대해 시뮬레이션이 수행됩니다.
또한, 응고 된 베드의 열 왜곡 및 잔류 응력은 FLOW-3D를 사용하여 평가할 수 있으며, 보다 복잡한 분석을 수행하기 위해 FLOW-3D의 압력 및 온도 데이터를 Abaqus 및 MSC Nastran과 같은 FEA 소프트웨어로 내보낼 수 있습니다.

Sequence of a multi-layer L-PBF simulation setup in FLOW-3D

Ease of Use

FLOW-3D는 다양한 응용 분야에서 거의 40 년 동안 사용되어 왔습니다. 사용자 피드백을 기반으로 UI 개발자는 소프트웨어를 사용하기 매우 직관적으로 만들었으며 새로운 사용자는 시뮬레이션 설정의 순서를 거의 또는 전혀 어려움없이 이해합니다.
사용자는 FLOW3D에서 구현 된 다양한 모델의 이론에 정통하며 새로운 실험을 설계 할 수 있습니다. 실습 튜토리얼, 비디오 강의, 예제 시뮬레이션 및 기술 노트의 저장소도 사용할 수 있습니다.
사용자가 특정 수준의 경험에 도달하면 고급 수치 교육 및 소프트웨어 사용자 지정 교육을 사용할 수 있습니다.

Available Literature

실험 데이터에 대해 FLOW-3D 모델을 검증하는 몇 가지 독립적으로 발표된 연구가 있습니다. 여기에서 수록된 저널 논문은 레이저 용접 및 적층 제조 공정으로 제한됩니다. 더 많은 참조는 당사 웹 사이트에서 확인할 수 있습니다.

Laser Welding

  1. L.J.Zhang, J.X.Zhang, A.Gumenyuk, M.Rethmeier, S.J.Na, Numerical simulation of full penetration laser welding of thick steel plate with high power high brightness laser, Journal of Materials Processing Technology, Volume 214, Issue 8, 2014.
    A study by researchers from BAM in Germany, KAIST in Korea, and State Key Laboratory of Mechanical Behavior of Materials in China that focuses on keyhole dynamics and full penetration laser welding of steel plates.
  2. Runqi Lin, Hui-ping Wang, Fenggui Lu, Joshua Solomon, Blair E.
    Carlson, Numerical study of keyhole dynamics and keyhole-induced porosity formation in remote laser welding of Al alloys, International Journal of Heat and Mass Transfer, Volume 108, Part A, 2017.
    General Motors (GM) and Shangai University collaborated on a study on the influence of welding speed and weld angle of inclination on porosity occurrence in laser keyhole welding.
  3. Koji Tsukimoto, Masashi Kitamura, Shuji Tanigawa, Sachio Shimohata, and Masahiko Mega, Laser Welding Repair for Single Crystal Blades, International Gas Turbine Congress, Tokyo, 2015.
    Mitsubishi Heavy Industry’s study on laser welding repair using laser cladding for single Ni crystal alloys used in gas turbine blades.

Additive Manufacturing

  1. Yu-Che Wu, Cheng-Hung San, Chih-Hsiang Chang, Huey-Jiuan Lin, Raed Marwan, Shuhei Baba, Weng-Sing Hwang, Numerical modeling of melt-pool behavior in selective laser melting with random powder distribution and experimental validation, Journal of Materials Processing Technology, Volume 254, 2018
    This paper discusses powder bed compaction with random packing for different powder-size distributions, and the importance of considering evaporation effects in the melting process to validate the melt pool dimensions.
  2. Lee, Y.S., and W.Zhang, Mesoscopic simulation of heat transfer and fluid flow in laser powder bed additive manufacturing, Proceedings of the Annual International Solid Freeform Fabrication Symposium, Austin, TX, USA. 2015
    A study conducted by Ohio State University researchers to understand the influence of process parameters in formation of balling defects.
  3. Y.S. Lee, W.Zhang, Modeling of heat transfer, fluid flow and solidification microstructure of nickel-base superalloy fabricated by laser powder bed fusion, Additive Manufacturing, Volume 12, Part B, 2016
    A study conducted by Ohio State University researchers to understand the influence of solidification parameters, calculated from the temperature fields, on solidification morphology and grain size using existing theoretical models in laser powder bed fusion processes.

 

 

레이저 용접 수치해석(FLOW WELD)

Laser Welding

뛰어난 생산성과 속도, 낮은 열 입력이 결합되어 기존의 용접 프로세스를 대체하는 레이저 용접 프로세스가 있습니다. 레이저 용접이 제공하는 장점은 용접강도가 좋고, 열 영향 부위가 작으며, 정밀도가 높고 변형이 적으며 강철, 알루미늄, 티타늄 및 이종 금속을 포함한 광범위한 금속 및 합금을 용접 할 수 있는 기능이 있습니다.

FLOW-3D는 레이저 용접 공정에 대한 강력한 통찰력을 제공하고 궁극적으로 프로세스 최적화를 달성하는 데 도움이 됩니다. 보다 나은 프로세스 제어를 통해 다공성을 최소화할 수 있습니다. 열 영향부위 및 마이크로-구조를 제어합니다. FLOW-3D는 자유표면 추적 알고리즘으로 인해 매우 복잡한 용접 풀 시뮬레이션을 해석하는데 적합합니다. 용접의 추가 모듈은 레이저 소스에 의해 생성된 Heat flux, 용융 금속에 대한 증발압력, shield gas효과, 용융 풀의 반동압력 및 다중 레이저반사와 같은 물리적 모델을 FLOW-3D에 통합하기 위해 개발되었습니다. Keyhole 용접과 같은 현실적인 프로세스 시뮬레이션을 위해서는 모든 관련 물리적 현상을 포착하는 것이 중요합니다.

FLOW-3D는 레이저 용접의 conduction and keyhole 방식을 시뮬레이션 할 수 있습니다. 전 세계의 연구원들은 FLOW-3D를 사용하여 용접역학을 분석하고, 공정 매개 변수를 최적화하여 다공성을 최소화하며, 레이저 용접공정의 수지결정 성장을 예측합니다.

Shallow penetration weld (top left); deep penetration weld with shield gas effects (top right); deep penetration weld with shield gas and evaporation pressure (bottom left); and deep penetration weld with shield gas, evaporation pressure and multiple laser reflections effects (bottom right).

Full Penetration Laser Welding Experiments

한국 카이스트와 독일 BAM은 16KW레이저를 사용하여 10mm강판에 완전 침투 레이저 용접 실험을 수행하였습니다. CCD카메라의 도움을 받아 완전 용입 레이저 용접으로 형성된 상단 및 하단 용융지 역학을 포착할 수 있었습니다. 그들은 또한 FLOW-3D공정을 시뮬레이션하여 해석과 실험결과가 경향이 일치하는 것을 나타내었습니다.

Experimental setup with CCD cameras observing the top and bottom molten pools
 
Simulation results at the top show melt pool lengths of 8mm and 15mm, whereas experiments indicated melt pool lengths of 7mm and 13mm
 
 
 
 
Schematic of computation domain in FLOW-3D

 

Laser Welding Porosity Case Study

General Motors, Michigan, 중국의 상하이 대학교는 공정변수, 즉 keyhole 용접에서 다공성 발생 에 대해 용접속도 및 용접각도와 같은 공정 매개 변수가 미치는 영향을 이해하기 위해 협력하여 연구를 진행하였습니다.

 
레이저 용접된 Al 접합부 단면의 다공성을 용접합니다. Keyhole 유도 된 다공성은 유동 역학으로 인해 발생되고 균열을 일으킬 수 있습니다. 최적화 공정의 매개변수는 이러한 종류의 다공성을 완화할 수 있습니다. FLOW-3D를 사용하여 연구원들은 증발 및 반동 압력, 용융풀, 온도에 따른 표면장력 및 Keyhole내의 다중 레이저 반사, 프레넬 흡수를 포함한 모든 중요한 물리적 현상을 설명했습니다.

연구진은 시뮬레이션 모델을 기반으로 Keyhole용접에서 유도된 다공성의 주요 원인으로 불안정한Keyhole을 규정하였습니다. 아래 이미지에서 볼 수 있듯이 뒤쪽 용융 풀의 과도한 재순환은 뒤쪽 용융 풀이 앞쪽 용융 풀 경계를 무너뜨리며 다공성을 초래시킵니다. 갇힌 공간이 증가하는 응고 전면에 의해 포착되었을 때 다공성이 유도되었습니다.

용접 속도가 빠를수록 더 큰 keyhole이 생성되며 이로 인해보다 안정적인 keyhole이 구성됩니다. 연구진은 FLOW-3D를 사용하여 높은 용접 속도와 큰 용접 경사각으로 다공성을 완화시킬 수 있다고 예측했습니다.

 
 
Distribution of porosity in longitudinal welding sections as seen in simulations (top) and experiments (bottom)

용접분야 활용

Conduction 용접

하이브리드 레이저 용접

깊은 용접 레이저용접

레이저 적층 공법

TIG 용접

이종소재 레이저 용접

FLOW-3D CAST Suites

FLOW-3D CAST Suites

FLOW-3D CAST v5 comes in Suites of relevant casting processes: 

HIGH PRESSURE DIE CASTING SUITE

Process Workspace

High Pressure Die Casting

Features

Thermal Die Cycling
– Cooling/heating channels
– Spray cooling
Filling
– Shot sleeve with Plunger
– Shot motion
– Ladles, stoppers
– Venting efficiency
– PQ^2 analysis
– HPDC machine database
Solidification
– Squeeze pins
Cooling


PERMANENT MOLD CASTING SUITE

Process Workspaces

Permanent Mold Casting
Low Pressure Die Casting
Tilt Pour Casting

Features

Thermal Die Cycling
– Cooling/heating channels
Filling
– Tilt pouring
Solidification
– Squeeze pins
Cooling


SAND CASTING SUITE

Process Workspaces

Sand Casting
Low Pressure Sand Casting

Features

Filling
– Permeable molds
– Moisture evaporation in molds
– Gas generation in cores
– Ladle model
Solidification
– Exothermic sleeves
– Chills
– Cast iron solidification
Cooling


LOST FOAM CASTING SUITE

Process Workspaces

Lost Foam
Sand Casting
Low Pressure Sand Casting

Features

Filling
– Permeable molds
– Moisture evaporation in molds
– Gas generation in cores
– Ladle model
– Lost foam pattern evaporation models (Fast model and Full model)
– Lost foam defect prediction
Solidification
– Exothermic sleeves
– Chills
– Cast iron solidification
Cooling

 


ALL SUITES INCLUDE THESE CORE FEATURES:

Solver Engine

  • TruVOF – The most accurate filling simulation tool in the industry
  • Heat transfer and solidification
  • Shrinkage – Rapid Shrinkage model and Shrinkage with flow model
  • Temperature dependent properties
  • Multi-block meshing including conforming meshes
  • Turbulence models
  • Non-Newtonian viscosity (shear thinning/thickening, thixotropic)
  • Flow tracers
  • Active Simulation Control with Global Conditions
  • Surface tension model
  • Thermal stress analysis with warpage
  • General moving geometry w/6 DOF

FlowSight

  • Multi-case analysis
  • Porosity analysis tool

Defect Prediction Tools

  • Gas entrainment model
  • Thermal Modulus output
  • Hot Spot identification
  • Micro and macro porosity prediction
  • Surface defect prediction
  • Shrinkage
  • Cavitation and Cavitation Potential
  • Particle models (Inclusion modeling, collapsed bubble tracking)

User Conveniences

  • Process-oriented workspaces
  • Configurable Simulation Monitor
  • Metal and solid material databases
  • Heat transfer database
  • Filter database
  • Remote solving queues
  • Quick Analyze/Display tool

[FLOW-3D 물리모델]Condensation, Evaporation at Free Surfaces / 자유표면에서의 응축, 기화

Condensation/Evaporation at Free Surfaces자유표면에서의 응축/기화

1. Vaporization at Free Surfaces 자유표면에서의 기화

자유표면에서 발생하는 기화효과는 공간에서 정의된 일정 포화상태의 견지에서 모델링 될 수 있다. 이 모델을 활성화하기 위해 Physics>Bubble and phase change models>Constant pressure bubble with vaporization 를 선택한다. Fluids>Properties>Phase Change 에서의 Saturation Temperature 는 공간내의 기포의 포화상태를 정의한다. 기화 잠열은 Fluids>Phase change>Latent Heat of Vapor 에서 지정된다.

유체 에너지 방정식(열전달)은 이 모델(Physics>Heat Transfer)과 함께 해석되어야 한다. Fluids> Properties>Phase Change 에있는 Accommodation coefficient 에 양의 값을 정의한다. 자유 표면상의 액체의 온도가 포화 온도보다 높다면 액체는 다음과 같은 율로 증발할 것이다.

  • α 는 기화율을 조절하는 Accommodation coefficient이다. 이 값은 일반적으로 0.01에서0.1사이이며 1.0을 넘지 말아야 한다.
  • Hv 는 기화 잠열이다.
  • Asur 는 상변화를 위한 유효표면적이다.
  • kf 는 액체의 열전도도이다.
  • Tl 는 표면상 액체 온도이며
  • Tv1는일정한 기포 포화 온도이다
  • h 는 Prandtl 수로 정의된 표면에 있는 액체의 열전도에 대한 특정 길이이다.

여기서

  • xmin 는 (임의의 방향으로)계산 격자의 최소 셀 크기
  • Cv 는 일정 체적시의 기포 비열이며
  • µ1는 유체 #1의 점도이다.

각 표면 셀에서 기화하는 질량 유량은 후처리를 위해 저장되고 Analyze 에서 가시화될 수 있다.

기화는 자유 표면을 포함하는 셀들에서만 발생될 수 있다. 기포 포화온도는 일정 또는 변동압력을 갖는 모든 공간에 대해 일정하며 같다.

2. One Fluid with Thermal Bubbles 열기포를 갖는 하나의 유체

액체-증기 상변화에 의한 질량 전달은 열기포와 주위 액체 사이에 발생할 수 있다. 기포는 유체 #1 이 증기로 차 있다고 가정하고(즉, 기체 성분은 하나다.) 기포는 일정 압력, 온도, 그리고 밀도를 갖는다. 많은 기포 방울들이 있을 수 있고, 각 기포에서의 증기는 체적 변화와 열 및 질량 전달 때문에 고유한 시간에 따라 변하는 상을 갖는다. 유체 분율이0인 지정 압력의 격자 경계와 접하는 기포는 그 경계에서 정의된 기화 상태를 가질 것이다. 기화/응축모델은 Physics>Bubble and phase change models>Thermal bubbles with phase change 에서 활성화된다.

증기의 상태방정식은 이상 기체 방정식이며 절대 압력 P P = (γ − 1) · ρvapCvT 로부터 계산되는데 여기서

  • γ 는 1.285 ≤ γ ≤ 1.667값을 갖는 비열의 비율
  • T 는 절대온도
  • Cv 는 일정 체적에서의 증기의 비열
  • Cp 는 일정 압력에서의 증기의 비열
  • ρvap 는 기포 내의 증기 밀도

기포는 절대 단위로 이들의 초기 압력과 온도를 지정함으로써 초기화된다. 증기는 또한 Cavitation and Bubble Formation (Nucleation)에서 기술된 바와 같이 공동 또는 비등 과정을 통해 유체 내에서 생성될 수 있다. 증기 물성과 포화 곡선은 Fluids>Properties>Phase change 하위 메뉴에서 정의된다. 증기 압력은 사용자가 정의한 포화 곡선을 이용하여 그 지역의 유체 온도의 함수로써 계산된다. 디폴트 포화 곡선은 압력 P 와 온도 T 간의 Clausius-Clapeyron 관련식이다.

여기서

  • PV 1 TV 1(위의 물성치 목록에서 Saturation Pressure Saturation Temperature라고 쓰여있는) 는 포화곡선상의 한 점에서의 압력과 온도이다.
  • TEXPExponent for T-P Curve 로써 입력된다; 이의 값은 일반적으로
  • γ 는 증기의 비열 Gamma
  • Cv 는 일정 체적시의 기체 비열
  • Hv 는 기체의 잠열

형상 요소와 기포 내 증기간의 열전달은 Meshing & Geometry>Geometry>Component>Surface properties 의 component-void간의 열전달 계수에 의해 지정된다. 액체와 기포 내 증기와의 열전달도 마찬가지로 유체-void간의 열전달 계수에 의해 지정되어야 한다. 새로 생성된 증기기포는 heat transfer void type 1로 지정되는 것에 주목한다. Physics>Heat transfer>Fluid to solid heat transfer 가 증기 기포와 고체 요소간의 열전달을 가능하게 하기 위해 활성화되어야 한다.

상 변화는 계산 셀 내의 평균 유체 물성(밀도, 열에너지 그리고 액체분율)에 의존한다. 특히 액체와 증기의 온도는 한 요소에서 같으며, 표면의 얇은 유체막에서의 온도가 아니다. 이런 의미에서 상변화 모델은 현상학적이고 상변화율을 조절하기 위해 accommodation coefficient 의 조정이 필요하다. 1보다 큰 값은 사용되지 않아야 하는데, 이는 이 모델의 수렴이 힘들게 될 수도 있기 때문이다. 사실 일반적으로 사용되는 값들은 0.01과 0.1사이이다.

3. Two-fluid Model 두가지 유체 모델

이 모델은 증기 영역에서 모든 역학이 계산되는 것을 제외하고는 응축/기화 모델 (One Fluid with Thermal Bubbles)과 유사하다. 이 경우 압축 two-fluid 모델(비압축성 유체와 압축성 증기)은 경계면에서 발생하는 액체-증기 상변화가 가능하다. 순수 액체 지역에서의 핵 생성 또는 순수 증기 지역에서의 응축이 또한 가능하다. 유체 #1은 유체의 액상을 그리고 압축성 유체 #2(가스)는 증기를 기술한다. 표준 압축성 유동 모델에서와 같이 증기의 상태 방정식은 이상 기체 방정식, P = RF2 · ρ · T 이며 여기서.

  • RF2 는 증기의 기체상수
  • P 는 압력
  • ρ 는 기체 밀도
  • T 는 증기의 온도

two-fluid 상변화 모델은 Physics >Bubble and phase change models> Two-fluid phase change 에서 초기화되며, Fluids>Properties>Phase change 에서 양의 accommodation coefficient 를 필요로 한다. 상변화율은 직접적으로 accommodation coefficient 에 비례한다. 이 값은 절대적인 제한은 아니지만 일반적으로 0.01에서0.1사이이며 1.0을 넘지 말아야 한다. 증기 물성은 압축성 유체2의 물성으로 정의되며 증기 잠열과 포화곡선은 Fluids>Properties>Phase change 에서 정의된다. 포화 압력과 포화 온도로 정의되며 쌍으로 나타나는 압력-온도는 포화 곡선상의 한 점이어야 한다. T-P 곡선상의 지수는 온도-압력 포화관계의 지수이다. 디폴트 포화곡선은 압력 P 와 온도 T 간의 Clausius-Clapeyron 관련식이다.

여기서

  • PV 1 TV 1(위의 물성 목록에서 Saturation Pressure Saturation Temperature라고 쓰여있는)는 포화 곡선상의 한 점에서의 압력과 온도
  • TEXPExponent for T-P Curve 로써 입력된다; 이 값은 일반적으로 TV EXP = (γ − 1) CLHVCV 2 1
  •  Gamma 는 증기의 비열의 비율
  • CV 2 는 일정 체적시의 기체 비열
  • CLHV 1는 증기 잠열(단위질량당 에너지)

상변화는 유한 체적 내의 평균 유체 물성(밀도, 열에너지 그리고 액체분율)에 의존한다. 특히 액체와 증기의 온도는 한 요소에서 같다. 액체와 증기 경계면에서의 질량 전달율은 국부적 액체의 포화압력과 증기압사이의 차이에 의하여 계산된다.

Mass transfer rate

여기서

  • Pvap 는 증기압
  • Psat(T) 는 위에서 정의된 바와 같이 지역온도에서의 포화압력이다. 사용자가 필요에 따라 변경할 수 있는 subroutine PSAT.F에서 계산된다.
  • RSIZEAccommodation coefficient 이고 일반적으로 0.01과 0.1사이의 값이다.

액체와 증기경계에서 유체 질량의 단위면적당 상변화율이 계산되고, 후처리를 위해 Phase change mass flux 라고 불리는 공간변수로써 저장된다.
양의 값은 증발을 뜻한다:
음의 값은 응축.

액체 체적에서의 상변화는 Superheat temperature 를 지정함으로써 포화온도를 지나서까지 지연될 수 있다. 지역 포화온도보다 큰 Superheat temperature 의 값 때문에 증기 기포가 발생하기 전에 이 온도까지 유체 체적이 가열되는 것이 가능하다. 과열은 선택에따라 0이 아닌 벽의 거칠기를 사용함으로써 고체 벽 가까이에서 발생하지 않도록 할 수 있다.

4. Two Fluids with Non-condensable Gas / 비 응축가스를 갖는 Two Fluids

 

보통, 응축/기화 모델(two-fluid 모델)은 유체 #2가 완전히 액체의 증기상으로 이루어진다고 가정한다. 가스가 증기와 비응축가스(즉, 공기중의 수증기)의 혼합물로 구성되어 있는 경우에 Physics>Bubble and phase change>Two-fluid phase change>Noncondensable gas model 를 선택한다. two-fluid vapor 모델의 추가는 증기와 비응축가스의 기체상수들의 밀도 가중 평균 혼합물의 기체상수의 계산을 포함한다:

여기서

  • ρvap 는 계산된 거시적 증기밀도
  • ρnc 는 계산된 거시적 비응축 기체 밀도
  • RF2는 증기의 기체상수
  • RF 는 평균기체상수

그러므로, 압력은 P = RFρT 로 계산된다. 증기의 포화압력은 상변화(Two-fluid Model), 를 갖는 표준 Two-fluid 모델에서와 같은 방법으로 계산되지만, 질량 유량은 전체 가스압력을 사용하는 것과는 달리 증기의 부분압력을 이용하여 계산된다.

Mass transfer rate

여기서

  • Pvap 는 가스성 유체의 증기의 부분압력
  • Psat(T) 는 사용자가 필요에 따라 변경할 수 있는 subroutine PSAT.F에서 정의되는 Clausius-Clapeyron 방정식으로부터 계산되는 국부 온도에서의 포화압력이다.
  • RSIZEAccommodation coefficient 이고 일반적으로 0.01과 0.1사이의 값이다.

Accommodation coefficient 가 1.0의 값을 가진다면 모델은 한 시간단계에서 평형에 도달하기에 충분한 상변화를 예측하려고 시도할 것이다. 이 속도는 너무 급속해 실제 물리적조건과 비교될 수가 없다. 액체와 가스의 경계면의 경계층 내의 역학은 규모가 너무 작아 이 모델에 포함할 수 없으므로 FLOW-3D 가 정확히 이 계수 없이 상변화율을 예측하는 것은 불가능하다. .

이 모델을 이용하기 위해 Physics>Bubble and phase change models>Non-condensable gas model 의 체크상자를 선택한다. Gas constant Specific heat of the non-condensable gas 를 위한 값을 입력한다. 가스가 영역 경계에서 들어오는 곳에 각 mesh block 경계 조건 입력창에 있는 Non-condensable gas fraction 의 비응축가스의 체적율(0 과 1사이)을 지정한다. 비응축가스를 포함하는 초기 유체지역을 정의하기 위해 Meshing & Geometry>Initial>Global 를 지정한다. 이 양은 또한 각각의 초기유체 영역과 특정 지점에서 지정될 수 있다.

5. Vaporization Residue / 증발 잔류량

MAIN VARIABLES: SCALAR: IRESID, RMXSC
XPUT: IPHCHG

액체용제가 기화할 때 이에 포함되어 있는 용질은 더 농축된다. 마찬가지로 스칼라 농도변수로 모델링 된 용질도 유체문제의 자유표면에서 증발로 인해 자동적으로 농축될 것이다. 표면요소에 액체가 반보다 적게 있을 경우 농축변화가 표면요소의 두께의 반에 해당하는 지역으로 퍼져나가는 크기로 스칼라의 농축이 바로 주위의 표면요소에서도 또한 발생할 것이다.

 증발이 충분히 발생하고 용질의 농도가 커지면 표면에서 발생할 수도 있고 용질이 완전히 증발하면 표면상에 이의 잔류가 생성될 수 있다. 잔류형성은 Physics Bubbles and phase change 에서 활성화되는 Constant pressure bubbles with vaporization, 및 Thermal bubbles with phase change 모델과 함께 시뮬레이션 되어야 한다. 잔류모델은 IRESID = 1로 지정하고 용질 스칼라 ns, RMXSC(ns)를 최대 packing 밀도를 정의함으로써 활성화된다. 일단 용질이 최대 packing 밀도까지 농축되면 더 이상의 농축은 고정(움직이지 않는)된 잔류를 초래한다. 하나 이상의 스칼라 용질이 존재하면 잔류는 모든 용질 전체 잔류를 기록한다.

Note: 용질농도는 Physics Scalars 로부터 FLOW-3D‘s Scalars 모델을 이용하여 입력된다.

FSR-05-14_moisture drying model [수분/습기 건조 모델]

Introduction
In the manufacture of paper it is necessary to remove all water from the paper before it is rolled up. The majority of water is typically removed by squeezing the paper between large rollers. The remaining moisture can be removed by forcing hot air through the paper to accelerate its evaporation.
Using heated air can be an expensive process so there is interest in investigating optimum arrangements for achieving the fastest and least expensive means of removing the residual water from paper. A prototype arrangement using heated air is shown in the following figure: (그림은 첨부파일 참조)

Both the paper and the fabric backing are porous materials. The support blocks may not be porous. It is expected that the permeability of the fabric and paper will be a function of their water content.
This report describes a software development that allows for a realistic treatment of the drying process in porous media such as that shown in Fig. 1. A description is given of the new model, which has been validated with available data. This data does not cover the entire range of moisture content or airflow rates that are typically encountered in practice. Consequently, it may be found necessary to make some small model adjustments. It is hoped that the formulation of the model, which is based on simple physical principles, will be easy to adjust to fit a larger range of observations.
Before describing the new model, a better perspective of its capabilities can be appreciated by noting some of the ways that it differs from previous work on paper drying. Most importantly, the new model considers the paper as having finite thickness and properties such as moisture content, temperature and vapor concentration that vary through the thickness. Thus, the paper may have dried on the upstream side, but still be completely wet on the opposite side. Another difference is that air and water vapor constitute a two-component gas that is compressible. Compressibility means, for
example, that the gas velocity in the paper must increase in the direction of flow because of the decrease in pressure through the paper (i.e., density and/or temperature must decrease by expansion to give a pressure decrease). Since flow velocity has an important effect on drying rate, compressibility can influence local drying conditions in the paper.

Finally, by computing transient conditions throughout the paper, this model could be used to investigate arbitrary non-uniform initial conditions or paper with a non-uniform thickness and/or porosity distribution.

 

[다운로드]

FSR-05-14_moisture drying model

Simulating the Residue left by Evaporating Drops

Background
The “coffee ring” effect is the name given to a well known observation where the evaporative drying of a drop of coffee leaves behind a ring of dark material at the edge of the original drop. On first thought one would expect that the coffee particles, which are uniformly distributed in the drop, would simply be deposited uniformly over the area wetted by the drop. It has only been in recent years that researchers have uncovered the mechanisms that produce the ring effect (Deegan, R.D., et al).
As currently understood, the edges of drops can become pinned because of roughness or chemical elements on the surface on which they lie. Heat transfer to the drops from the substrate or the air induces evaporation, which is usually greater near the drop edge. Surface tension forces then adjust the curvature of the remaining liquid consistent with the pinned edge, which results in a net flow of liquid toward the edge. This flow replenishes the evaporative loss but also moves solute to the edge where it is concentrated by evaporation. Eventually, this mechanism builds up a ring deposit of solute at the original edge of the drop.
The residue from dried drops has implications for many useful applications, including general coating processes, formation of pixel arrays of organic materials for video displays and for a variety of micro-electro-mechanical (MEMS) devices.
Because many factors control the distribution of dried residue it is desirable to have some means to model the fluid dynamics of the process to aid engineers in making the best choices for each specific application. Such a capability has been incorporated into FLOW-3D1 making it possible to computationally investigate the influence of such parameters as the initial solute concentration, fluid viscosity, volatility of the solvent, evaporation rate, surface tension and initial shape of the drop.
This technical note presents a brief description of the residue formation model and illustrates it with several computations of an evaporating drop subject to different physical conditions.

Microfluidics Bibliography

Microfluidics Bibliography

다음은 Microfluidics Bibliography의 기술 문서 모음입니다.
이 모든 논문은 FLOW-3D  결과를 특징으로  합니다. 미세 유체 공정 및 장치 를 성공적으로 시뮬레이션하기 위해 FLOW-3D 를 사용 하는 방법에 대해 자세히 알아보십시오  .

2021년 8월 26일 Update

45-21   Navid Tonekaboni, Mahdi Feizbahr, Nima Tonekaboni, Guang-Jun Jiang, Hong-Xia Chen, Optimization of solar CCHP systems with collector enhanced by porous media and nanofluid, Mathematical Problems in Engineering, 2021; 9984940, 2021. doi.org/10.1155/2021/9984840

40-21   B. Hayes, G.L. Whiting, R. MacCurdy, Modeling of contactless bubble–bubble interactions in microchannels with integrated inertial pumps, Physics of Fluids, 33.4; 042002, 2021. doi.org/10.1063/5.0041924

Below is a collection of technical papers in our Microfluidics Bibliography. All of these papers feature FLOW-3D results. Learn more about how FLOW-3D can be used to successfully simulate microfluidic processes and devices.

14-21   Jian-Chiun Liou, Chih-Wei Peng, Philippe Basset, Zhen-Xi Chen, DNA printing integrated multiplexer driver microelectronic mechanical system head (IDMH) and microfluidic flow estimation, Micromachines, 12.1; 25, 2021. doi.org/10.3390/mi12010025

08-20   Li Yong-Qiang, Dong Jun-Yan and Rui Wei, Numerical simulation for capillary driven flow in capsule-type vane tank with clearances under microgravity, Microgravity Science and Technology, 2020. doi.org/10.1007/s12217-019-09773-z

89-19   Tim Dreckmann, Julien Boeuf, Imke-Sonja Ludwig, Jorg Lumkemann, and Jorg Huwyler, Low volume aseptic filling: impact of pump systems on shear stress, European Journal of Pharmeceutics and Biopharmeceutics, in press, 2019. doi:10.1016/j.ejpb.2019.12.006

88-19   V. Amiri Roodan, J. Gomez-Pastora, C. Gonzalez-Fernandez, I.H. Karampelas, E. Bringas, E.P. Furlani, and I. Ortiz, CFD analysis of the generation and manipulation of ferrofluid droplets, TechConnect Briefs, pp. 182-185, 2019. TechConnect World Innovation Conference & Expo, Boston, Massachussetts, USA, June 17-19, 2019.

55-19     Julio Aleman, Sunil K. George, Samuel Herberg, Mahesh Devarasetty, Christopher D. Porada, Aleksander Skardal, and Graça Almeida‐Porada, Deconstructed microfluidic bone marrow on‐a‐chip to study normal and malignant hemopoietic cell–niche interactions, Small, 2019. doi: 10.1002/smll.201902971

37-19     Feng Lin Ng, Miniaturized 3D fibrous scaffold on stereolithography-printed microfluidic perfusion culture, Doctoral Thesis, Nanyang Technological University, Singapore, 2019.

32-19     Jenifer Gómez-Pastora, Ioannis H. Karampelas, Eugenio Bringas, Edward P. Furlani, and Inmaculada Ortiz, Numerical analysis of bead magnetophoresis from flowing blood in a continuous-flow microchannel: Implications to the bead-fluid interactions, Nature: Scientific Reports, Vol. 9, No. 7265, 2019. doi: 10.1038/s41598-019-43827-x

01-19  Jelena Dinic and Vivek Sharma, Computational analysis of self-similar capillary-driven thinning and pinch-off dynamics during dripping using the volume-of-fluid method, Physics of Fluids, Vol. 31, 2019. doi: 10.1063/1.5061715

75-18   Tobias Ladner, Sebastian Odenwald, Kevin Kerls, Gerald Zieres, Adeline Boillon and Julien Bœuf, CFD supported investigation of shear induced by bottom-mounted magnetic stirrer in monoclonal antibody formulation, Pharmaceutical Research, Vol. 35, 2018. doi: 10.1007/s11095-018-2492-4

53-18   Venoos Amiri Roodan, Jenifer Gómez-Pastora, Aditi Verma, Eugenio Bringas, Inmaculada Ortiz and Edward P. Furlani, Computational analysis of magnetic droplet generation and manipulation in microfluidic devices, Proceedings of the 5th International Conference of Fluid Flow, Heat and Mass Transfer, Niagara Falls, Canada, June 7 – 9, 2018; Paper no. 154, 2018.  doi: 10.11159/ffhmt18.154

35-18   Jenifer Gómez-Pastora, Cristina González Fernández, Marcos Fallanza, Eugenio Bringas and Inmaculada Ortiz, Flow patterns and mass transfer performance of miscible liquid-liquid flows in various microchannels: Numerical and experimental studies, Chemical Engineering Journal, vol. 344, pp. 487-497, 2018. doi: 10.1016/j.cej.2018.03.110

16-18   P. Schneider, V. Sukhotskiy, T. Siskar, L. Christie and I.H. Karampelas, Additive Manufacturing of Microfluidic Components via Wax Extrusion, Biotech, Biomaterials and Biomedical TechConnect Briefs, vol. 3, pp. 162 – 165, 2018.

15-18   J. Gómez-Pastora, I.H. Karampelas, A.Q. Alorabi, M.D. Tarn, E. Bringas, A. Iles, V.N. Paunov, N. Pamme, E.P. Furlani, I. Ortiz, CFD analysis and experimental validation of magnetic droplet generation and deflection across multilaminar flow streams, Biotech, Biomaterials and Biomedical TechConnect Briefs, vol. 3, pp. 182-185, 2018.

14-18   J. Gómez-Pastora, C. González-Fernández, I.H. Karampelas, E. Bringas, E.P. Furlani, and I. Ortiz, Design of Magnetic Blood Cleansing Microdevices through Experimentally Validated CFD Modeling, Biotech, Biomaterials and Biomedical TechConnect Briefs, vol. 3, pp. 170-173, 2018.

10-18   A. Gupta, I.H. Karampelas, J. Kitting, Numerical modeling of the formation of dynamically configurable L2 lens in a microchannel, Biotech, Biomaterials and Biomedical TechConnect Briefs, Vol. 3, pp. 186 – 189, 2018.

17-17   I.H. Karampelas, J. Gómez-Pastora, M.J. Cowan, E. Bringas, I. Ortiz and E.P. Furlani, Numerical Analysis of Acoustophoretic Discrete Particle Focusing in Microchannels, Biotech, Biomaterials and Biomedical TechConnect Briefs 2017, Vol. 3

16-17   J. Gómez-Pastora, I.H. Karampelas, E. Bringas, E.P. Furlani and I. Ortiz, CFD analysis of particle magnetophoresis in multiphase continuous-flow bioseparators, Biotech, Biomaterials and Biomedical TechConnect Briefs 2017, Vol. 3

15-17   I.H. Karampelas, S. Vader, Z. Vader, V. Sukhotskiy, A. Verma, G. Garg, M. Tong and E.P. Furlani, Drop-on-Demand 3D Metal Printing, Informatics, Electronics and Microsystems TechConnect Briefs 2017, Vol. 4

102-16   J. Brindha, RA.G. Privita Edwina, P.K. Rajesh and P.Rani, “Influence of rheological properties of protein bio-inks on printability: A simulation and validation study,” Materials Today: Proceedings, vol. 3, no.10, pp. 3285-3295, 2016. doi: 10.1016/j.matpr.2016.10.010

99-16   Ioannis H. Karampelas, Kai Liu, Fatema Alali, and Edward P. Furlani, Plasmonic Nanoframes for Photothermal Energy Conversion, J. Phys. Chem. C, 2016, 120 (13), pp 7256–7264

98-16   Jelena Dinic and Vivek Sharma, Drop formation, pinch-off dynamics and liquid transfer of simple and complex fluidshttp://meetings.aps.org/link/BAPS.2016.MAR.B53.12, APS March Meeting 2016, Volume 61, Number 2, March 14–18, 2016, Baltimore, Maryland

67-16  Vahid Bazargan and Boris Stoeber, Effect of substrate conductivity on the evaporation of small sessile droplets, PHYSICAL REVIEW E 94, 033103 (2016), doi: 10.1103/PhysRevE.94.033103

57-16   Ioannis Karampelas, Computational analysis of pulsed-laser plasmon-enhanced photothermal energy conversion and nanobubble generation in the nanoscale, PhD Dissertation: Department of Chemical and Biological Engineering, University at Buffalo, State University of New York, July 2016

44-16   Takeshi Sawada et al., Prognostic impact of circulating tumor cell detected using a novel fluidic cell microarray chip system in patients with breast cancer, EBioMedicine, Available online 27 July 2016, doi: 10.1016/j.ebiom.2016.07.027.

39-16   Chien-Hsun Wang, Ho-Lin Tsai, Yu-Che Wu and Weng-Sing Hwang, Investigation of molten metal droplet deposition and solidification for 3D printing techniques, IOP Publishing, J. Micromech. Microeng. 26 (2016) 095012 (14pp), doi: 10.1088/0960-1317/26/9/095012, July 8, 2016

30-16   Ioannis H. Karampelas, Kai Liu and Edward P. Furlani, Plasmonic Nanocages as Photothermal Transducers for Nanobubble Cancer Therapy, Nanotech 2016 Conference & Expo, May 22-25, Washington, DC.

29-16   Scott Vader, Zachary Vader, Ioannis H. Karampelas and Edward P. Furlani, Advances in Magnetohydrodynamic Liquid Metal Jet Printing, Nanotech 2016 Conference & Expo, May 22-25, Washington, DC.

02-16  Stephen D. Hoath (Editor), Fundamentals of Inkjet Printing: The Science of Inkjet and Droplets, ISBN: 978-3-527-33785-9, 472 pages, February 2016 (see chapters 2 and 3 for FLOW-3D results)

125-15   J. Berthier, K.A. Brakke, E.P. Furlani, I.H. Karampelas, V. Poher, D. Gosselin, M. Cubinzolles and P. Pouteau, Whole blood spontaneous capillary flow in narrow V-groove microchannels, Sensors and Actuators B: Chemical, 206, pp. 258-267, 2015.

86-15   Yousub Lee and Dave F. Farson, Simulation of transport phenomena and melt pool shape for multiple layer additive manufacturing, J. Laser Appl. 28, 012006 (2016). doi: 10.2351/1.4935711, published online 2015.

77-15   Ho-Lin Tsai, Weng-Sing Hwang, Jhih-Kai Wang, Wen-Chih Peng and Shin-Hau Chen, Fabrication of Microdots Using Piezoelectric Dispensing Technique for Viscous Fluids, Materials 2015, 8(10), 7006-7016. doi: 10.3390/ma8105355

63-15   Scott Vader, Zachary Vader, Ioannis H. Karampelas and Edward P. Furlani, Magnetohydrodynamic Liquid Metal Jet Printing, TechConnect World Innovation Conference & Expo, Washington, D.C., June 14-17, 2015

46-15   Adwaith Gupta, 3D Printing Multi-Material, Single Printhead Simulation, Advanced Qualification of Additive Manufacturing Materials Workshop, July 20 – 21, 2015, Santa Fe, NM

28-15   Yongqiang Li, Mingzhu Hu, Ling Liu, Yin-Yin Su, Li Duan, and Qi Kang, Study of Capillary Driven Flow in an Interior Corner of Rounded Wall Under MicrogravityMicrogravity Science and Technology, June 2015

20-15   Pamela J. Waterman, Diversity in Medical Simulation Applications, Desktop Engineering, May 2015, pp 22-26,

16-15   Saurabh Singh, Ann Junghans, Erik Watkins, Yash Kapoor, Ryan Toomey, and Jaroslaw Majewski, Effects of Fluid Shear Stress on Polyelectrolyte Multilayers by Neutron Scattering Studies, © 2015 American Chemical Society, DOI: 10.1021/acs.langmuir.5b00037, Langmuir 2015, 31, 2870−2878, February 17, 2015

11-15   Cheng-Han Wu and Weng-Sing Hwang, The effect of process condition of the ink-jet printing process on the molten metallic droplet formation through the analysis of fluid propagation direction, Canadian Journal of Physics, 2015. doi: 10.1139/cjp-2014-0259

03-15 Hanchul Cho, Sivasubramanian Somu, Jin Young Lee, Hobin Jeong and Ahmed Busnaina, High-Rate Nanoscale Offset Printing Process Using Directed Assembly and Transfer of Nanomaterials, Adv. Materials, doi: 10.1002/adma.201404769, February 2015

122-14  Albert Chi, Sebastian Curi, Kevin Clayton, David Luciano, Kameron Klauber, Alfredo Alexander-Katz, Sebastián D’hers and Noel M Elman, Rapid Reconstitution Packages (RRPs) implemented by integration of computational fluid dynamics (CFD) and 3D printed microfluidics, Research Gate, doi: 10.1007/s13346-014-0198-7, July 2014

113-14 Cihan Yilmaz, Arif E. Cetin, Georgia Goutzamanidis, Jun Huang, Sivasubramanian Somu, Hatice Altug, Dongguang Wei and Ahmed Busnaina, Three-Dimensional Crystalline and Homogeneous Metallic Nanostructures Using Directed Assembly of Nanoparticles, 10.1021/nn500084g, © 2014 American Chemical Society, April 2014

110-14 Koushik Ponnuru, Jincheng Wu, Preeti Ashok, Emmanuel S. Tzanakakis and Edward P. Furlani, Analysis of Stem Cell Culture Performance in a Microcarrier Bioreactor System, Nanotech, Washington, D.C., June 15-18, 2014

109-14   Ioannis H. Karampelas, Young Hwa Kim and Edward P. Furlani, Numerical Analysis of Laser Induced Photothermal Effects using Colloidal Plasmonic Nanostructures, Nanotech, Washington, D.C., June 15-18, 2014

108-14   Chenxu Liu, Xiaozheng Xue and Edward P. Furlani, Numerical Analysis of Fully-Coupled Particle-Fluid Transport and Free-Flow Magnetophoretic Sorting in Microfluidic Systems, Nanotech, Washington, D.C., June 15-18, 2014

95-14   Cheng-Han Wu, Weng-Sing Hwang, The effect of the echo-time of a bipolar pulse waveform on molten metallic droplet formation by squeeze mode piezoelectric inkjet printing, Accepted November 2014, Microelectronics Reliability (2014) , © 2014 Elsevier Ltd. All rights reserved.

85-14   Sudhir Srivastava, Lattice Boltzmann method for contact line dynamics, ISBN: 978-90-386-3608-5, Copyright © 2014 S. Srivastava

61-14   Chenxu Liu, A Computational Model for Predicting Fully-Coupled Particle-Fluid Dynamics and Self-Assembly for Magnetic Particle Applications, Master’s Thesis: State University of New York at Buffalo, 2014, 75 pages; 1561583, http://gradworks.umi.com/15/61/1561583.html

41-14 Albert Chi, Sebastian Curi, Kevin Clayton, David Luciano, Kameron Klauber, Alfredo Alexander-Katz, Sebastian D’hers, and Noel M. Elman, Rapid Reconstitution Packages (RRPs) implemented by integration of computational fluid dynamics (CFD) and 3D printed microfluidics, Drug Deliv. and Transl. Res., DOI 10.1007/s13346-014-0198-7, # Controlled Release Society 2014. Available for purchase online at SpringerLink.

21-14  Suk-Hee Park, Ung Hyun Koh, Mina Kim, Dong-Yol Yang, Kahp-Yang Suh and Jennifer Hyunjong Shin, Hierarchical multilayer assembly of an ordered nanofibrous scaffold via thermal fusion bonding, Biofabrication 6 (2014) 024107 (10pp), doi:10.1088/1758-5082/6/2/024107, IOP Publishing, 2014. Available for purchase online at IOP.

17-14   Vahid Bazargan, Effect of substrate cooling and droplet shape and composition on the droplet evaporation and the deposition of particles, Ph.D. Thesis: Department of Mechanical Engineering, The University of British Columbia, March 2014, © Vahid Bazargan, 2014

73-13  Oliver G. Harlen, J. Rafael Castrejón-Pita, and Arturo Castrejon-Pita, Asymmetric Detachment from Angled Nozzles Plates in Drop-on Demand Inkjet Printing, NIP & Digital Fabrication Conference, 2013 International Conference on Digital Printing Technologies. Pages 253-549, pp. 277-280(4)

63-13  Fatema Alali, Ioannis H. Karampelas, Young Hwa Kim, and Edward P. Furlani, Photonic and Thermofluidic Analysis of Colloidal Plasmonic Nanorings and Nanotori for Pulsed-Laser Photothermal ApplicationsJ. Phys. Chem. C, Article ASAP, DOI: 10.1021/jp406986y, Copyright © 2013 American Chemical Society, September 2013.

25-13  Sudhir Srivastava, Theo Driessen, Roger Jeurissen, Herma Wijshoff, and Federico Toschi, Lattice Boltzmann Method to Study the Contraction of a Viscous Ligament, International Journal of Modern Physics © World Scientific Publishing Company, May 2013.

11-13  Li-Chieh Hsu, Yong-Jhih Chen, Jia-Huang Liou, Numerical Investigation in the Factors on the Pool Boiling, Applied Mechanics and Materials Vol. 311 (2013) pp 456-461, © (2013) Trans Tech Publications, Switzerland, doi:10.4028/www.scientific.net/AMM.311.456. Available for purchase online at Scientific.Net.

10-13 Pamela J. Waterman, CFD: Shaping the Medical World, Desktop Engineering, April 2013. Full article available online at Desktop Engineering.

90-12 Charles R. Ortloff and Martin Vogel, Spray Cooling Heat Transfer- Test and CFD Analysis, Electronics Cooling, June 2012. Available online at Electronics Cooling.

79-12    Daniel Parsaoran Siregar, Numerical simulation of evaporation and absorption of inkjet printed droplets, Ph.D. Thesis: Technische Universiteit Eindhoven, September 18, 2012, Copyright 2012 by D.P. Siregar, ISBN: 978-90-386-3190-5.

71-12   Jong-hyeon Chang, Kyu-Dong Jung, Eunsung Lee, Minseog Choi, Seungwan Lee, and Woonbae Kim, Varifocal liquid lens based on microelectrofluidic technology, Optics Letters, Vol. 37, Issue 21, pp. 4377-4379 (2012) http://dx.doi.org/10.1364/OL.37.004377

70-12   Jong-hyeon Chang, Kyu-Dong Jung, Eunsung Lee, Minseog Choi, and Seunwan Lee, Microelectrofluidic Iris for Variable ApertureProc. SPIE 8252, MOEMS and Miniaturized Systems XI, 82520O (February 9, 2012); doi:10.1117/12.906587

69-12   Jong-hyeon Chang, Eunsung Lee, Kyu-Dong Jung, Seungwan Lee, Minseog Choi, and  Woonbae Kim, Microelectrofluidic Lens for Variable CurvatureProc. SPIE 8486, Current Developments in Lens Design and Optical Engineering XIII, 84860X (October 11, 2012); doi:10.1117/12.925852.

61-12  Biddut Bhattacharjee, Study of Droplet Splitting in an Electrowetting Based Digital Microfluidic System, Thesis: Doctor of Philosophy in the College of Graduate Studies (Applied Sciences), The University of British Columbia, September 2012, © Biddut Bhattacharjee.

55-12 Hejun Li, Pengyun Wang, Lehua Qi, Hansong Zuo, Songyi Zhong, Xianghui Hou, 3D numerical simulation of successive deposition of uniform molten Al droplets on a moving substrate and experimental validation, Computational Materials Science, Volume 65, December 2012, Pages 291–301. Available for purchase online at SciVerse.

54-12   Edward P. Furlani, Anthony Nunez, Gianmarco Vizzeri, Modeling Fluid Structure-Interactions for Biomechanical Analysis of the Human Eye, Nanotech Conference & Expo, June 18-21, 2012, Santa Clara, CA.

53-12   Xinyun Wu, Richard D. Oleschuk and Natalie M. Cann, Characterization of microstructured fibre emitters in pursuit of improved nano electrospray ionization performance, The Royal Society of Chemistry 2012, http://pubs.rsc.org, DOI: 10.1039/c2an35249d, May 2012

25-12    Edward P. Furlani, Ioannis H. Karampelas and Qian Xie, Analysis of Pulsed Laser Plasmon-assisted Photothermal Heating and Bubble Generation at the Nanoscale, Lab on a Chip, 10.1039/C2LC40495H, Received 01 May 2012, Accepted 07 Jun 2012. First published on the web 13 Jun 2012.

22-12  R.A. Sultanov, D. Guster, Numerical Modeling and Simulations of Pulsatile Human Blood Flow in Different 3D-Geometries, Book chapter #21 in Fluid Dynamics, Computational Modeling and Applications (2012), ISBN: 978-953-51-0052-2, p. 475 [18 pages]. Available online at INTECH.

21-12  Guo-Wei Huang, Tzu-Yi Hung, and Chin-Tai Chen, Design, Simulation, and Verification of Fluidic Light-Guide Chips with Various Geometries of Micro Polymer Channels, NEMS 2012, Kyoto, Japan, March 5-8, 2012. Available for purchase online at IEEE.

103-11   Suk-Hee Park, Development of Three-Dimensional Scaffolds containing Electrospun Nanofibers and their Applications to Tissue Regeneration, Ph.D. Thesis: School of Mechanical, Aersospace and Systems Engineering, Division of Mechanical Engineering, KAIST, 2011.

81-11   Xinyun Wu, Modeling and Characterization of Microfabricated Emitters-In Pursuit of Improved ESI-MS Performance, thesis: Department of Chemistry, Queen’s University, December 2011, Copyright © Xinyun Wu, 2011

79-11  Cong Lu, A Cell Preparation Stage for Automatic Cell Injection, thesis: Graduate Department of Mechanical and Industrial Engineering, University of Toronto, Copyright © Cong Lu, 2011

77-11 Ge Bai, W. Thomas Leach, Computational fluid dynamics (CFD) insights into agitation stress methods in biopharmaceutical development, International Journal of Pharmaceutics, Available online 8 December 2011, ISSN 0378-5173, 10.1016/j.ijpharm.2011.11.044. Available online at SciVerse.

72-11  M.R. Barkhudarov, C.W. Hirt, D. Milano, and G. Wei, Comments on a Comparison of CFD Software for Microfluidic Applications, Flow Science Technical Note #93, FSI-11-TN93, December 2011

45-11  Chang-Wei Kang, Jiak Kwang Tan, Lunsheng Pan, Cheng Yee Low and Ahmed Jaffar, Numerical and experimental investigations of splat geometric characteristics during oblique impact of plasma spraying, Applied Surface Science, In Press, Corrected Proof, Available online 20 July 2011, ISSN 0169-4332, DOI: 10.1016/j.apsusc.2011.06.081. Available to purchase online at SciVers

33-11  Edward P. Furlani, Mark T. Swihart, Natalia Litchinitser, Christopher N. Delametter and Melissa Carter, Modeling Nanoscale Plasmon-assisted Bubble Nucleation and Applications, Nanotech Conference and Expo 2011, Boston, MA, June 13-16, 2011

32-11  Lu, Cong and Mills, James K., Three cell separation design for realizing automatic cell injection, Complex Medical Engineering (CME), 2011 IEEE/ICME, pp: 599 – 603, Harbin, China, 10.1109/ICCME.2011.5876811, June 2011. Available online at IEEEXplore.

25-11 Issam M. Bahadur, James K. Mills, Fluidic vacuum-based biological cell holding device with piezoelectrically induced vibration, Complex Medical Engineering (CME), 2011 IEEE/ICME International Conference on, 22-25 May 2011, pp: 85 – 90, Harbin, China. Available online at: IEEE Xplore.

14-11  Edward P. Furlani, Roshni Biswas, Alexander N. Cartwright and Natalia M. Litchinitser, Antiresonant guiding optofluidic biosensor, doi:10.1016/j.optcom.2011.04.014, Optics Communication, April 2011

05-11 Hyeju Eom and Keun Park, Integrated numerical analysis to evaluate replication characteristics of micro channels in a locally heated mold by selective induction, International Journal of Precision Engineering and Manufacturing, Volume 12, Number 1, 53-60, DOI: 10.1007/s12541-011-0007-x, 2011. Available online at: SpringerLink.

70-10  I.N. Volnov, V.S. Nagornyi, Modeling Processes for Generation of Streams of Monodispersed Fluid Droplets in Electro-inkjet Applications, Science and Technology News, St. Petersburg State Polytechnic University, 4, pp 294-300, 2010. In Russian.

62-10  F. Mobadersani, M. Eskandarzade, S. Azizi and S. Abbasnezhad, Effect of Ambient Pressure on Bubble Growth in Micro-Channel and Its Pumping Effect, ESDA2010-24436, pp. 577-584, doi:10.1115/ESDA2010-24436, ASME 2010 10th Biennial Conference on Engineering Systems Design and Analysis (ESDA2010), Istanbul, Turkey, July 12–14, 2010. Available online at the ASME Digital Library.

58-10 Tsung-Yi Ho, Jun Zeng, and Chakrabarty, K, Digital microfluidic biochips: A vision for functional diversity and more than moore, Computer-Aided Design (ICCAD), 2010 IEEE/ACM International Conference on, DOI: 10.1109/ICCAD.2010.5654199, © IEEE, November 2010. Available online at IEEE Explore.

51-10  Regina Bleul, Marion Ritzi-Lehnert, Julian Höth, Nico Scharpfenecker, Ines Frese, Dominik Düchs, Sabine Brunklaus, Thomas E. Hansen-Hagge, Franz-Josef Meyer-Almes, Klaus S. Drese, Compact, cost-efficient microfluidics-based stopped-flow device, Anal Bioanal Chem, DOI 10.1007/s00216-010-4446-5, Available online at Springer, November 2010

22-10    Krishendu Chakrabarty, Richard B. Fair and Jun Zeng, Design Tools for Digital Microfluidic Biochips Toward Functional Diversification and More than Moore, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, Vol. 29, No. 7, July 2010

14-10 E. P. Furlani and M. S. Hanchak, Nonlinear analysis of the deformation and breakup of viscous microjets using the method of lines, International Journal for Numerical Methods in Fluids (2010), © 2010 John Wiley & Sons, Ltd., Published online in Wiley InterScience. DOI: 10.1002/fld.2205

55-09 R.A. Sultanov, and D. Guster, Computer simulations of  pulsatile human blood flow through 3D models of the human aortic arch, vessels of simple geometry and a bifurcated artery, Proceedings of the 31st Annual International Conference of the IEEE EMBS (Engineering in Medicine and Biology Society), Minneapolis, September 2-6, 2009, p.p. 4704-4710.

30-09 Anurag Chandorkar and Shayan Palit, Simulation of Droplet Dynamics and Mixing in Microfluidic Devices using a VOF-Based Method, Sensors & Transducers journal, ISSN 1726-5479 © 2009 by IFSA, Vol.7, Special Issue “MEMS: From Micro Devices to Wireless Systems,” October 2009, pp. 136-149.

13-09 E.P. Furlani, M.C. Carter, Analysis of an Electrostatically Actuated MEMS Drop Ejector, Presented at Nanotech Conference & Expo 2009, Houston, Texas, USA, May 3-7, 2009

12-09 A. Chandorkar, S. Palit, Simulation of Droplet-Based Microfluidics Devices Using a Volume-of-Fluid Approach, Presented at Nanotech Conference & Expo 2009, Houston, Texas, USA, May 3-7, 2009

3-09 Christopher N. Delametter, FLOW-3D Speeds MEMS Inkjet Development, Desktop Engineering, January 2009

42-08  Tien-Li Chang, Jung-Chang Wang, Chun-Chi Chen, Ya-Wei Lee, Ta-Hsin Chou, A non-fluorine mold release agent for Ni stamp in nanoimprint process, Microelectronic Engineering 85 (2008) 1608–1612

26-08 Pamela J. Waterman, First-Pass CFD Analyses – Part 2, Desktop Engineering, November 2008

09-08 M. Ren and H. Wijshoff, Thermal effect on the penetration of an ink droplet onto a porous medium, Proc. Eurotherm2008 MNH, 1 (2008)

04-08 Delametter, Christopher N., MEMS development in less than half the time, Small Times, Online Edition, May 2008

02-08 Renat A. Sultanov, Dennis Guster, Brent Engelbrekt and Richard Blankenbecler, 3D Computer Simulations of Pulsatile Human Blood Flows in Vessels and in the Aortic Arch – Investigation of Non-Newtonian Characteristics of Human Blood, The Journal of Computational Physics, arXiv:0802.2362v1 [physics.comp-ph], February 2008

01-08 Herman Wijshoff, thesis: University of Twente, Structure- and fluid dynamics in piezo inkjet printheads, ISBN 978-90-365-2582-4, Venlo, The Netherlands January 2008.

30-07 A. K. Sen, J. Darabi, and D. R. Knapp, Simulation and parametric study of a novel multi-spray emitter for ESI–MS applications, Microfluidics and Nanofluidics, Volume 3, Number 3, June 2007, pp. 283-298(16)

28-07 Dan Soltman and Vivek Subramanian, Inkjet-Printed Line Morphologies and Temperature Control of the Coffee Ring Effect, Langmuir; 2008; ASAP Web Release Date: 16-Jan-2008; (Research Article) DOI: 10.1021/la7026847

23-07 A K Sen and J Darabi, Droplet ejection performance of a monolithic thermal inkjet print head, Journal of Micromechanical and Microengineering,vol.17, pp.1420-1427 (2007) doi:10.1088/0960-1317/17/8/002; Abstract only.

18-07 Herman Wisjhoff, Better Printheads Via Simulation, Desktop Engineering, October 2007, Vol. 13, Issue 2

17-07 Jos de Jong, Ph.D. Thesis: University of Twente, Air entrapment in piezo inkjet printing, ISBN 978-90-365-2483-4, April 2007

15-07 Krishnendu Chakrabarty and Jun Zeng, (Ed.), Design Automation Methods and Tools for Microfluidics-Based Biochips, Springer, September 2006.

14-07 Fei Su and Jun Zeng, Computer-aided design and test for digital microfluidics, IEEE Design & Test of Computers, 24(1), 2007, 60-70.

13-07 Jun Zeng, Modeling and simulation of electrified droplets and its application to computer-aided design of digital microfluidics, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 25(2), 2006, 224-233.

12-07 Krishnendu Chakrabarty and Jun Zeng, (2005), Automated top-down design for microfluidic biochips, ACM Journal on Emerging Technologies in Computing Systems, 1(3), 2005, 186–223.

01-07 Wijshoff, Herman, Drop formation mechanisms in piezo-acoustic inkjet, NSTI-Nanotech 2007, ISBN 1420061844 Vol. 3, 2007)

23-06 John J. Uebbing, Stephan Hengstler, Dale Schroeder, Shalini Venkatesh, and Rick Haven, Heat and Fluid Flow in an Optical Switch Bubble, Journal of Microelectromechanical Systems, Vol. 15, No. 6, December 2006

21-06 Wijshoff, Herman, Manipulating Drop Formation in Piezo Acoustic Inkjet, Proc. IS&T’s NIP22, 79 (2006)

20-06 J. de Jong, H. Reinten, M. van den Berg, H. Wijshoff, M. Versluis, G. de Bruin, A. Prosperetti and D. Lohse, Air entrapment in piezo-driven inkjet printheads, J. Acoust. Soc. Am. 120(3), 1257 (2006)

11-06 A. K. Sen, J. Darabi, D. R. Knapp and J. Liu, Modeling and Characterization of a Carbon Fiber Emitter for Electrospray Ionization, 1 MEMS and Microsystems Laboratory, Department of Mechanical Engineering, University of South Carolina, 300 Main Street, Columbia, SC 29208, USA, 2 Department of Pharmacology, Medical University of South Carolina, Charleston, SC

5-06 E. P. Furlani, B. G. Price, G. Hawkins, and A. G. Lopez, Thermally Induced Marangoni Instability of Liquid Microjets with Application to Continuous Inkjet Printing, Proceedings of NSTI Nanotech Conference 2006, Vol. 2, pp 534-537.

28-05 O B Fawehinmi, P H Gaskell, P K Jimack, N Kapur, and H M Thompson, A combined experimental and computational fluid dynamics analysis of the dynamics of drop formation, May 2005. DOI: 10.1243/095440605X31788

5-05 E. P. Furlani, Thermal Modulation and Instability of Newtonian Liquid Microjets, presented at Nanotech 2005, Anaheim, CA, May 8-12, 2005.

1-05 C.W. Hirt, Electro-Hydrodynamics of Semi-Conductive Fluids: With Application to Electro-Spraying, Flow Science Technical Note #70, FSI-05-TN70

19-04 G. F. Yao, Modeling of Electroosmosis Without Resolving Physics Inside a Electric Double Layer, Flow Science Technical Note (FSI-04-TN69)

12-04 Jun Zeng and Tom Korsmeyer, Principles of Droplet Electrohydrodynamics for Lab-on-a-Chip, Lab. Chip. Journal, 2004, 4(4), 265-277

9-04 Constantine N. Anagnostopoulos, James M. Chwalek, Christopher N. Delametter, Gilbert A. Hawkins, David L. Jeanmaire, John A. Lebens, Ali Lopez, and David P. Trauernicht, Micro-Jet Nozzle Array for Precise Droplet Metering and Steering Having Increased Droplet Deflection, Proceedings of the 12th International Conference on Solid State Sensors, Actuators and Microsystems, sponsored by IEEE, Boston, June 8-12, 2003, pp. 368-71

8-04 Christopher N. Delametter, David P. Trauernicht, James M. Chwalek, Novel Microfluidic Jet Deflection – Significant Modeling Challenge with Great Application Potential, Technical Proceedings of the 2002 International Conference on Modeling and Simulation of Microsystems sponsored by NSTI, San Juan, Puerto Rico, April 21-25, 2002, pp. 44-47

6-04 D. Vadillo*, G. Desie**, A Soucemarianadin*, Spreading Behavior of Single and Multiple Drops, *Laboratoire des Ecoulements Geophysiques et Industriels (LEGI), and **AGFA-Gevaert Group N.V., XXI ICTAM, 15-21 August 2004, Warsaw, Poland

2-04 Herman Wijshoff, Free Surface Flow and Acousto-Elastic Interaction in Piezo Inkjet, Nanotech 2004, sponsored by the Nano Science & Technology Institute, Boston, MA, March 2004

30-03 D Souders, I Khan and GF Yao, Alessandro Incognito, and Matteo Corrado, A Numerical Model for Simulation of Combined Electroosmotic and Pressure Driven Flow in Microdevices, 7th International Symposium on Fluid Control, Measurement and Visualization

27-03 Jun Zeng, Daniel Sobek and Tom Korsmeyer, Electro-Hydrodynamic Modeling of Electrospray Ionization – CAD for a µFluidic Device-Mass Spectrometer Interface, Agilent Technologies Inc, paper presented at Transducers 2003, June 03 Boston (note: Reference #10 is to FLOW-3D)

17-03 John Uebbing, Switching Fiber-optic Circuits with Microscopic Bubbles, Sensors Magazine, May 2003, Vol 20, No 5, p 36-42

16-03 CFD Speeds Development of MEMS-based Printing Technology, MicroNano Magazine, June 2003, Vol 8, No 6, p 16

3-03 Simulation Speeds Design of Microfluidic Medical Devices, R&D Magazine, March 2003, pp 18-19

1-03 Simulations Help Microscopic Bubbles Switch Fiber-Optic Circuits, Agilent Technologies, Fiberoptic Product News, January 2003, pp 22-23

27-02 Feng, James Q., A General Fluid Dynamic Analysis of Drop Ejection in Drop-on-Demand Ink Jet Devices, Journal of Imaging Science and Technology®, Volume 46, Number 5, September/October 2002

1-02 Feixia Pan, Joel Kubby, and Jingkuang Chen, Numerical Simulation of Fluid Structure Interaction in a MEMS Diaphragm Drop Ejector, Xerox Wilson Research Center, Institute of Physics Publishing, Journal of Micromechanics and Microengineering, 12 (2002), PII: SO960-1317(02)27439-2, pp. 70-76

48-01   Rainer Gruber, Radial Mass Transfer Enhancement in Bubble-Train Flow, PhD thesis in Engineering Sciences, Rheinisch- Westf alischen Technische Hochschule Aachen, December 2001.

34-01 Furlani, E.P., Delametter, C.N., Chwalek, J.M., and Trauernicht, D., Surface Tension Induced Instability of Viscous Liquid Jets, Fourth International Conference on Modeling and Simulation of Microsystems, April 2001

12-01 C. N. Delametter, Eastman Kodak Company, Micro Resolution, Mechanical Engineering, Col 123/No 7, July 2001, pp 70-72

11-01 C. N. Delametter, Eastman Kodak Company, Surface Tension Induced Instability of Viscous Liquid Jets, Technical Proceeding of the Fourth International Conference on Modeling and Simulation of Microsystems, April 2001

9-01 Aman Khan, Unipath Limited Research and Development, Effects of Reynolds Number on Surface Rolling in Small Drops, PVP-Col 431, Emerging Technologies for Fluids, Structures and Fluids, Structures and Fluid Structure Interaction — 2001

2-00 Narayan V. Deshpande, Significance of Inertance and Resistance in Fluidics of Thermal Ink-Jet Transducers, Journal of Imaging Science and Technology, Volume 40, Number 5, Sept./Oct. 1996, pp.457-461

4-98 D. Deitz, Connecting the Dots with CFD, Mechanical Engineering Magazine, pp. 90-91, March 1998

14-94 M. P. O’Hare, N. V. Deshpande, and D. J. Drake, Drop Generation Processes in TIJ Printheads, Xerox Corporation, Adv. Imaging Business Unit, IS&T’s Tenth International Congress on Advances in Non-Impact Printing, Tech. 1994

14-92 Asai, A.,Three-Dimensional Calculation of Bubble Growth and Drop Ejection in a Bubble Jet Printer, Journal of Fluids Engineering Vol. 114 December 1992:638-641

Contact Line Insights

Contact Line Insights

FLOW-3D의 수치 모델링 기능은 코팅 성능 향상에 관심이 있는 엔지니어에게 이상적입니다. 계산 시뮬레이션은 코팅 흐름에 영향을 미치는 다양한 물리적 공정의 상대적 중요성과 효과를 연구하는 훌륭한 방법입니다. 물리적 테스트에서 프로세스를 분리하거나 해당 프로세스의 규모를 임의로 조정하는 것이 항상 가능한 것은 아닙니다. 이 섹션에서는 리 블릿 형성(rivulet formation), 핑거링(fingering), 증발, 거친 표면 위의 접촉선 이동 및 유체 흡수와 관련하여 FLOW-3D의 정적 및 동적 접촉각 처리에 대해 설명합니다.

Static and Dynamic Contact Angles

FLOW-3D는 입력으로 설정된 정적 접촉각의 함수로 동적 접촉각과 자유 표면 인터페이스에서 작용하는 관련 힘을 정확하게 계산하여 유체의 소수성을 캡처 할 수 있습니다. 아래 시뮬레이션은 물방울이 경사면 아래로 이동함에 따라 정적 접촉각이 동적 접촉각에 미치는 영향을 보여줍니다.

L.M. Hocking 박사는 그의 저서 [“A moving fluid interface on a rough surface,” J. Fluid Mech., 76, 801, (1976)]에서 표면에 미세한 요철이 흐름 구조를 유도하기 때문에 Contact line이 고체 표면을 통해 이동할 수 있으며 이는 거시적 관점에서 “velocity slip”로 해석 될 수 있다고 했습니다.

이 가설에 대한 전산 해석은 FLOW-3D를 이용하여 쉽게 수행됩니다. 선택된 테스트는 가로, 규칙적으로 이격 된 직사각형 슬롯 패턴 이차원 고체 표면 구성됩니다. 슬롯은 2mm 깊이 10mm 폭, 그리고 그들 사이 폭 10mm 고체 조각을 갖고 이격 됩니다. 이 크기는 전형적으로 상대적으로 부드러운 표면에 긁힌 모양입니다. 액체와 고체 사이의 정적인 접촉각이 60 °가 되도록 선택 하였습니다. 작동 유체는 물로 선정되었고 시험은 채널을 통해 속도30cm / s의 평균 물높이 15mm의 채널의 바닥에 있는 거친 표면을 두고 구동 이루어져 있습니다. 채널의 상단은 free-slip boundary로 정해집니다.

Hocking의 주장대로 micro-scale 교란이 Large scale 관점에서 보았을 때 계산된 속도장으로 보면 velocity slip의 한 종류로서 해석 될 수 있습니다. 아래는 계산된 수평 속도 분포를 나타내고 있습니다. 이것은 표면 바로 위에 제어 볼륨 층의 계산 된 수평 속도 분포를 제공하는 X-Y 플롯에 그래픽으로 보여 주고 있습니다. 격자 미세화에 의해 표면의 고체 부분의 윗쪽 속도가 영이 되는 경향이 있지만, 슬롯들 위에 있는 속도는 영이 안되게 유지됩니다. 많은 요철 위의 이러한 속도의 평균은 효과적인 슬립으로 해석 될 수 있는 non-zero 수평 이송 속도를 일으킵니다.

Evaporative Effects

분산된 고체 물질을 포함하는 액체 방울이 고체 표면에서 건조되면 고체 물질이 침전물로 남습니다. 이 퇴적물의 패턴은 많은 인쇄, 청소 및 코팅 공정에 중요한 의미를 갖습니다. 한 가지 유형의 침전물의 전형적인 예는 왼쪽 이미지와 같이 유출 된 커피 조각의 둘레를 따라 링 얼룩이 형성되는 “커피 링”문제입니다. 이러한 유형의 링 침전물은 액체의 증발로 인한 표면 장력 구동 흐름의 결과로 발생하며, 특히 방울 주변에서 발생합니다 [1].

Drying

건조는 코팅 공정의 중요한 부분입니다. 잘 도포된 코팅은 건조 결함으로 인해 완전히 손상될 수 있습니다. 건조 중에 온도 및 용질 구배는 밀도 및 표면 장력 구배로 인해 코팅 내 흐름을 유도 할 수 있으며, 이로 인해 잠재적으로 코팅 품질이 손상 될 수 있습니다. FLOW-3D의 증발 잔류물 모델을 통해 사용자는 건조로 인한 흐름을 시뮬레이션하고 값 비싼 물리적 실험에 소요되는 시간을 줄일 수 있습니다.

FLOW-3D’s evaporation residue model simulates a 3D view of residue formed from toluene after drying (magnified 30x)

Modeling Ring Formation

FLOW-3D는 증발이 가장 큰 접촉 라인에서의 증착으로 인해 에지 고정이 발생 함을 보여줍니다.

링 형성 모델링
증발에 의해 접촉 라인에서 생성 된 흐름 시뮬레이션
증발은 증발로 인한 열 손실로 인해 액체를 냉각시킵니다 (색상은 온도를 나타냄). 동시에 고체 표면은 전도에 의해 액체를 가열합니다. 증발은 접촉 라인 근처에서 가장 크므로 액체가 접촉 라인을 향해 흐르게하여 정적 상태를 다시 설정합니다. 최종 결과는 액체가 완전히 증발하는 액체 가장자리에 부유 고체가 증착됩니다.

FLOW-3D의 접촉 선 고정 모델에 대해 자세히 알아보십시오.

Simulation of flow generated at a contact line by evaporation

Dip Coating

Dip Coating

딥 코팅은 코팅 재료가 들어있는 탱크에 기판을 담그고 탱크에서 조각을 제거하여 배수하는 것입니다. 이와 같은 일시적인 코팅 문제는 고정 메쉬 내에서 유체의 움직임이 결정되기 때문에 FLOW-3D를 사용하여 간단하고 효율적으로 해결할 수 있습니다 (메쉬를 따르는 유체의 움직임이 아님). 

이 3D 시뮬레이션은 증발이 수반되는 딥 코팅 공정을 보여줍니다. 습식 필름은 용액에서 작은 개별 기판을 제거하여 증착됩니다. 모델은 추가적으로 용매의 증발을 설명합니다. 이는 필름 증착 중에 증발이 유체 역학과 겹치는 휘발성 용매의 경우와 관련이 있습니다. 잔류 물 모델은 코팅 된 건조 필름의 프로파일을 계산하는 고유 한 기능을 제공합니다. “가장자리 효과”의 정확한 평가를 통해 엔지니어는 최종 박막 형상 및 균질성에 대한 공정 매개 변수 또는 유체 특성의 영향을 분석 할 수 있습니다.

Dr. Julien Boeuf of Roche Diagnostics GmbH. 제공.

딥 코팅 공정에 대한 프레젠테이션은 Roche Diagnostics GmbH의 Julien Boeuf 박사의 2013 Conference Proceedings, “Model of dip coating with concomitant evaporation,“에서 확인할 수 있습니다.

FLOW-3D/MP Features List

FLOW-3D/MP Features

FLOW-3D/MP v6.1 은 FLOW-3D v11.1 솔버에 기초하여 물리 모델, 특징 및 그래픽 사용자 인터페이스가 동일합니다. FLOW-3D v11.1의 새로운 기능은 아래 파란색으로 표시되어 있으며 FLOW-3D/MP v6.1 에서 사용할 수 있습니다. 새로운 개발 기능에 대한 자세한 설명은 FLOW-3D v11.1에서 새로운 기능을 참조하십시오.

Meshing & Geometry

  • Structured finite difference/control volume meshes for fluid and thermal solutions
  • Finite element meshes in Cartesian and cylindrical coordinates for structural analysis
  • Multi-Block gridding with nested, linked, partially overlapping and conforming mesh blocks
  • Fractional areas/volumes (FAVOR™) for efficient & accurate geometry definition
  • Mesh quality checking
  • Basic Solids Modeler
  • Import CAD data
  • Import/export finite element meshes via Exodus-II file format
  • Grid & geometry independence
  • Cartesian or cylindrical coordinates
Flow Type Options
  • Internal, external & free-surface flows
  • 3D, 2D & 1D problems
  • Transient flows
  • Inviscid, viscous laminar & turbulent flows
  • Hybrid shallow water/3D flows
  • Non-inertial reference frame motion
  • Multiple scalar species
  • Two-phase flows
  • Heat transfer with phase change
  • Saturated & unsaturated porous media
Physical Modeling Options
  • Fluid structure interaction
  • Thermally-induced stresses
  • Plastic deformation of solids
  • Granular flow
  • Moisture drying
  • Solid solute dissolution
  • Sediment transport and scour
  • Cavitation (potential, passive tracking, active tracking)
  • Phase change (liquid-vapor, liquid-solid)
  • Surface tension
  • Thermocapillary effects
  • Wall adhesion
  • Wall roughness
  • Vapor & gas bubbles
  • Solidification & melting
  • Mass/momentum/energy sources
  • Shear, density & temperature-dependent viscosity
  • Thixotropic viscosity
  • Visco-elastic-plastic fluids
  • Elastic membranes & walls
  • Evaporation residue
  • Electro-mechanical effects
  • Dielectric phenomena
  • Electro-osmosis
  • Electrostatic particles
  • Joule heating
  • Air entrainment
  • Molecular & turbulent diffusion
  • Temperature-dependent material properties
  • Spray cooling
Flow Definition Options
  • General boundary conditions
    • Symmetry
    • Rigid and flexible walls
    • Continuative
    • Periodic
    • Specified pressure
    • Specified velocity
    • Outflow
    • Grid overlay
    • Hydrostatic pressure
    • Volume flow rate
    • Non-linear periodic and solitary surface waves
    • Rating curve and natural hydraulics
    • Wave absorbing layer
  • Restart from previous simulation
  • Continuation of a simulation
  • Overlay boundary conditions
  • Change mesh and modeling options
  • Change model parameters
Thermal Modeling Options
  • Natural convection
  • Forced convection
  • Conduction in fluid & solid
  • Fluid-solid heat transfer
  • Distributed energy sources/sinks in fluids and solids
  • Radiation
  • Viscous heating
  • Orthotropic thermal conductivity
  • Thermally-induced stresses
Turbulence Models
  • RNG model
  • Two-equation k-epsilon model
  • Two-equation k-omega model
  • Large eddy simulation
Metal Casting Models
  • Thermal stress & deformations
  • Iron solidification
  • Sand core blowing
  • Sand core drying
  • Permeable molds
  • Solidification & melting
  • Solidification shrinkage with interdendritic feeding
  • Micro & macro porosity
  • Binary alloy segregation
  • Thermal die cycling
  • Surface oxide defects
  • Cavitation potential
  • Lost-foam casting
  • Semi-solid material
  • Core gas generation
  • Back pressure & vents
  • Shot sleeves
  • PQ2 diagram
  • Squeeze pins
  • Filters
  • Air entrainment
  • Temperature-dependent material properties
  • Cooling channels
  • Fluid/wall contact time
Numerical Modeling Options
  • TruVOF Volume-of-Fluid (VOF) method for fluid interfaces
  • First and second order advection
  • Sharp and diffuse interface tracking
  • Implicit & explicit numerical methods
  • GMRES, point and line relaxation pressure solvers
  • User-defined variables, subroutines & output
  • Utilities for runtime interaction during execution
Fluid Modeling Options
  • One incompressible fluid – confined or with free surfaces
  • Two incompressible fluids – miscible or with sharp interfaces
  • Compressible fluid – subsonic, transonic, supersonic
  • Stratified fluid
  • Acoustic phenomena
  • Mass particles with variable density or diameter
Shallow Flow Models
  • General topography
  • Raster data interface
  • Subcomponent-specific surface roughness
  • Wind shear
  • Ground roughness effects
  • Laminar & turbulent flow
  • Sediment transport and scour
  • Surface tension
  • Heat transfer
  • Wetting & drying
Advanced Physical Models
  • General Moving Object model with 6 DOF–prescribed and fully-coupled motion
  • Rotating/spinning objects
  • Collision model
  • Tethered moving objects (springs, ropes, mooring lines)
  • Flexing membranes and walls
  • Porosity
  • Finite element based elastic-plastic deformation
  • Finite element based thermal stress evolution due to thermal changes in a solidifying fluid
  • Combusting solid components
Chemistry Models
  • Stiff equation solver for chemical rate equations
  • Stationary or advected species
Porous Media Models
  • Saturated and unsaturated flow
  • Variable porosity
  • Directional porosity
  • General flow losses (linear & quadratic)
  • Capillary pressure
  • Heat transfer in porous media
  • Van Genunchten model for unsaturated flow
Discrete Particle Models
  • Massless marker particles
  • Mass particles of variable size/mass
  • Linear & quadratic fluid-dynamic drag
  • Monte-Carlo diffusion
  • Particle-Fluid momentum coupling
  • Coefficient of restitution or sticky particles
  • Point or volumetric particle sources
  • Charged particles
  • Probe particles
Two-Phase & Two-Component Models
  • Liquid/liquid & gas/liquid interfaces
  • Variable density mixtures
  • Compressible fluid with a dispersed incompressible component
  • Drift flux
  • Two-component, vapor/non-condensable gases
  • Phase transformations for gas-liquid & liquid-solid
  • Adiabatic bubbles
  • Bubbles with phase change
  • Continuum fluid with discrete particles
  • Scalar transport
  • Homogeneous bubbles
  • Super-cooling
Coupling with Other Programs
  • Geometry input from Stereolithography (STL) files – binary or ASCII
  • Direct interfaces with EnSight®, FieldView® & Tecplot® visualization software
  • Finite element solution import/export via Exodus-II file format
  • PLOT3D output
  • Neutral file output
  • Extensive customization possibilities
  • Solid Properties Materials Database
Data Processing Options
  • State-of-the-art post-processing tool, FlowSight™
  • Batch post-processing
  • Report generation
  • Automatic or custom results analysis
  • High-quality OpenGL-based graphics
  • Color or B/W vector, contour, 3D surface & particle plots
  • Moving and stationary probes
  • Measurement baffles
  • Arbitrary sampling volumes
  • Force & moment output
  • Animation output
  • PostScript, JPEG & Bitmap output
  • Streamlines
  • Flow tracers
User Conveniences
  • Active simulation control (based on measurement of probes)
  • Mesh generators
  • Mesh quality checking
  • Tabular time-dependent input using external files
  • Automatic time-step control for accuracy & stability
  • Automatic convergence control
  • Mentor help to optimize efficiency
  • Change simulation parameters while solver runs
  • Launch and manage multiple simulations
  • Automatic simulation termination based on user-defined criteria
  • Run simulation on remote servers using remote solving
Multi-Processor Computing

FLOW-3D Features

The features in blue are newly-released in FLOW-3D v12.0.

Meshing & Geometry

  • Structured finite difference/control volume meshes for fluid and thermal solutions
  • Finite element meshes in Cartesian and cylindrical coordinates for structural analysis
  • Multi-Block gridding with nested, linked, partially overlapping and conforming mesh blocks
  • Conforming meshes extended to arbitrary shapes
  • Fractional areas/volumes (FAVOR™) for efficient & accurate geometry definition
  • Closing gaps in geometry
  • Mesh quality checking
  • Basic Solids Modeler
  • Import CAD data
  • Import/export finite element meshes via Exodus-II file format
  • Grid & geometry independence
  • Cartesian or cylindrical coordinates

Flow Type Options

  • Internal, external & free-surface flows
  • 3D, 2D & 1D problems
  • Transient flows
  • Inviscid, viscous laminar & turbulent flows
  • Hybrid shallow water/3D flows
  • Non-inertial reference frame motion
  • Multiple scalar species
  • Two-phase flows
  • Heat transfer with phase change
  • Saturated & unsaturated porous media

Physical Modeling Options

  • Fluid structure interaction
  • Thermally-induced stresses
  • Plastic deformation of solids
  • Granular flow
  • Moisture drying
  • Solid solute dissolution
  • Sediment transport and scour
  • Sludge settling
  • Cavitation (potential, passive tracking, active tracking)
  • Phase change (liquid-vapor, liquid-solid)
  • Surface tension
  • Thermocapillary effects
  • Wall adhesion
  • Wall roughness
  • Vapor & gas bubbles
  • Solidification & melting
  • Mass/momentum/energy sources
  • Shear, density & temperature-dependent viscosity
  • Thixotropic viscosity
  • Visco-elastic-plastic fluids
  • Elastic membranes & walls
  • Evaporation residue
  • Electro-mechanical effects
  • Dielectric phenomena
  • Electro-osmosis
  • Electrostatic particles
  • Joule heating
  • Air entrainment
  • Molecular & turbulent diffusion
  • Temperature-dependent material properties
  • Spray cooling

Flow Definition Options

  • General boundary conditions
    • Symmetry
    • Rigid and flexible walls
    • Continuative
    • Periodic
    • Specified pressure
    • Specified velocity
    • Outflow
    • Outflow pressure
    • Outflow boundaries with wave absorbing layers
    • Grid overlay
    • Hydrostatic pressure
    • Volume flow rate
    • Non-linear periodic and solitary surface waves
    • Rating curve and natural hydraulics
    • Wave absorbing layer
  • Restart from previous simulation
  • Continuation of a simulation
  • Overlay boundary conditions
  • Change mesh and modeling options
  • Change model parameters

Thermal Modeling Options

  • Natural convection
  • Forced convection
  • Conduction in fluid & solid
  • Fluid-solid heat transfer
  • Distributed energy sources/sinks in fluids and solids
  • Radiation
  • Viscous heating
  • Orthotropic thermal conductivity
  • Thermally-induced stresses

Numerical Modeling Options

  • TruVOF Volume-of-Fluid (VOF) method for fluid interfaces
  • Steady state accelerator for free-surface flows
  • First and second order advection
  • Sharp and diffuse interface tracking
  • Implicit & explicit numerical methods
  • Immersed boundary method
  • GMRES, point and line relaxation pressure solvers
  • User-defined variables, subroutines & output
  • Utilities for runtime interaction during execution

Fluid Modeling Options

  • One incompressible fluid – confined or with free surfaces
  • Two incompressible fluids – miscible or with sharp interfaces
  • Compressible fluid – subsonic, transonic, supersonic
  • Stratified fluid
  • Acoustic phenomena
  • Mass particles with variable density or diameter

Shallow Flow Models

  • General topography
  • Raster data interface
  • Subcomponent-specific surface roughness
  • Wind shear
  • Ground roughness effects
  • Manning’s roughness
  • Laminar & turbulent flow
  • Sediment transport and scour
  • Surface tension
  • Heat transfer
  • Wetting & drying

Turbulence Models

  • RNG model
  • Two-equation k-epsilon model
  • Two-equation k-omega model
  • Large eddy simulation

Advanced Physical Models

  • General Moving Object model with 6 DOF–prescribed and fully-coupled motion
  • Rotating/spinning objects
  • Collision model
  • Tethered moving objects (springs, ropes, breaking mooring lines)
  • Flexing membranes and walls
  • Porosity
  • Finite element based elastic-plastic deformation
  • Finite element based thermal stress evolution due to thermal changes in a solidifying fluid
  • Combusting solid components

Chemistry Models

  • Stiff equation solver for chemical rate equations
  • Stationary or advected species

Porous Media Models

  • Saturated and unsaturated flow
  • Variable porosity
  • Directional porosity
  • General flow losses (linear & quadratic)
  • Capillary pressure
  • Heat transfer in porous media
  • Van Genunchten model for unsaturated flow

Discrete Particle Models

  • Massless marker particles
  • Multi-species material particles of variable size and mass
  • Solid, fluid, gas particles
  • Void particles tracking collapsed void regions
  • Non-linear fluid-dynamic drag
  • Added mass effects
  • Monte-Carlo diffusion
  • Particle-fluid momentum coupling
  • Coefficient of restitution or sticky particles
  • Point or volumetric particle sources
  • Initial particle blocks
  • Heat transfer with fluid
  • Evaporation and condensation
  • Solidification and melting
  • Coulomb and dielectric forces
  • Probe particles

Two-Phase & Two-Component Models

  • Liquid/liquid & gas/liquid interfaces
  • Variable density mixtures
  • Compressible fluid with a dispersed incompressible component
  • Drift flux with dynamic droplet size
  • Two-component, vapor/non-condensable gases
  • Phase transformations for gas-liquid & liquid-solid
  • Adiabatic bubbles
  • Bubbles with phase change
  • Continuum fluid with discrete particles
  • Scalar transport
  • Homogeneous bubbles
  • Super-cooling
  • Two-field temperature

Coupling with Other Programs

  • Geometry input from Stereolithography (STL) files – binary or ASCII
  • Direct interfaces with EnSight®, FieldView® & Tecplot® visualization software
  • Finite element solution import/export via Exodus-II file format
  • PLOT3D output
  • Neutral file output
  • Extensive customization possibilities
  • Solid Properties Materials Database

Data Processing Options

  • State-of-the-art post-processing tool, FlowSight™
  • Batch post-processing
  • Report generation
  • Automatic or custom results analysis
  • High-quality OpenGL-based graphics
  • Color or B/W vector, contour, 3D surface & particle plots
  • Moving and stationary probes
  • Visualization of non-inertial reference frame motion
  • Measurement baffles
  • Arbitrary sampling volumes
  • Force & moment output
  • Animation output
  • PostScript, JPEG & Bitmap output
  • Streamlines
  • Flow tracers

User Conveniences

  • Active simulation control (based on measurement of probes)
  • Mesh generators
  • Mesh quality checking
  • Tabular time-dependent input using external files
  • Automatic time-step control for accuracy & stability
  • Automatic convergence control
  • Mentor help to optimize efficiency
  • Units on all variables
  • Custom units
  • Component transformations
  • Moving particle sources
  • Change simulation parameters while solver runs
  • Launch and manage multiple simulations
  • Automatic simulation termination based on user-defined criteria
  • Run simulation on remote servers using remote solving
  • Copy boundary conditions to other mesh blocks

Multi-Processor Computing

  • Shared memory computers
  • Distributed memory clusters

FlowSight

  • Particle visualization
  • Velocity vector fields
  • Streamlines & pathlines
  • Iso-surfaces
  • 2D, 3D and arbitrary clips
  • Volume render
  • Probe data
  • History data
  • Vortex cores
  • Link multiple results
  • Multiple data views
  • Non-inertial reference frame
  • Spline clip

MEMS/WELD 분야

Microfluidics

Microfluidics는 집적 회로 산업에서 사용되는 것과 유사한 공정을 사용하여 소형 기기의 제조에 급격하게 성장하는 기술입니다. Microfluidics 기술은 0.1 미크론에서 1mm에 이르기까지 매우 작은 장치로 기계, 유체, 광학, 전자 기능을 통합 할 수있는 방법을 제공합니다. Microfluidics는 기존의 방법과 비교하면 두 가지 중요한 장점이 있습니다. 첫째, 대량으로 제조 될 수 있으므로, 생산의 비용이 실질적으로 감소 될 수 있습니다. 둘째, 집적 회로에 통합 될 수 있어서 다른 기술보다 훨씬 더 복잡한 시스템으로 제조 될 수 있습니다.

Chip packaging simulation. Results generated by FLOW-3D/MP, FLOW-3D‘s HPC solution.

엔지니어 및 과학자가 설계, 시험 제작하고 그 성능을 최적화하기 위해 장치를 재 설계하는 등, 다른 제조 방법에서와 같이 microfluidics 설계 프로세스는 매우 고가 일 수 있습니다. 그러나, 수치 시뮬레이션은 전자, 기계, 화학, 열 과학 및 유체 과학 등의 분야에 걸쳐 정량 분석과 중요한 통찰력을 제공 할 수 있습니다.

laser-sintering

 

코팅분야

Coating

FLOW-3D는 산업계 및 학계의 코팅 연구원들이 기계 설계 연구, Display 공정개발 및 최적화를 위해 사용했습니다. 미크론 규모의 코팅 물리학을 이해하는 것은 코팅 유체 유변학의 복잡한 특성과 기판 및 Die와의 상호 작용으로 인해 어려울 수 있습니다.

FLOW-3D 는 비용이 많이 드는 실제 실험에 의존하지 않고, 코팅 프로세스를 분석할 수 있는 편리한 방법을 제공합니다. FLOW-3D는 표면 장력, Wall 접착, 용액 운반, 밀도 기반 흐름 및 상 변화의 영향을 이해하기위한 고밀도 모델링을 제공합니다.

Forward roll coating 공정에 대한 FLOW-3D의 시뮬레이션은 high capillary number수로 인한ribbing 결함을 포착합니다. 이 모델은 backing rollers가 400 micron nip을 통해 유체를 끌어 당길 때 표면 장력과 점도의 효과를 통합합니다. 시뮬레이션은 Lee, et al [1]의 연구를 기반으로합니다.

ribbing 시작에 대한 정확한 예측을 통해 엔지니어는 결함을 방지하기 위한 공정 매개 변수를 식별하고 수정할 수 있습니다.

Reference

[1] Lee, J. H., Han, S. K., Lee, J. S., Jung, H. W., & Hyun, J. C. (2010). Ribbing instability in rigid and deformable forward roll coating flows. Korea Australia Rheology Journal, 22(1), 75-80.

Bibliography

Models

Conference Proceedings


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